Low dielectric constant polymers for on-chip interlevel dielectrics with copper metallization

Materials Research Society Symposium - Proceedings

Volumn 381, Issue , 1995, Pages 177-195

  Gutmann, Ronald J ^a   Chow, T Paul ^a   Duquette, David J ^a   Lu, Toh Ming ^a   McDonald, John F ^a   Murarka, Shyam P ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; COPPER; ELECTRIC INSULATORS; INTEGRATED CIRCUIT MANUFACTURE; METALLIZING; MICROPROCESSOR CHIPS; PERMITTIVITY; POLYMERS; SEMICONDUCTOR DEVICE MANUFACTURE; VAPOR DEPOSITION;

COPPER INTERCONNECTS; COPPER PATTERNING; ON CHIP INTERLEVEL DIELECTRICS;

DIELECTRIC MATERIALS;

EID: 0029205036     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-381-177     Document Type: Conference Paper

References (20)