Analyses of post metal etch cleaning in downstream H2O-based plasma followed by a wet chemistry

Journal of the Electrochemical Society

Volumn 146, Issue 10, 1999, Pages 3843-3851

  Li, Hua ^a,b   Baklanov, Mikhail ^a   Boullart, Werner ^a   Conard, Thierry ^a   Brijs, Bert ^a   Maex, Karen ^a   Froyen, Ludo ^a  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CHEMICAL CLEANING; PLASMA ETCHING; REACTIVE ION ETCHING; REDOX REACTIONS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

CARBON TETRAFLUORIDE; POSTETCH CLEANING;

SEMICONDUCTING FILMS;

EID: 0033339850     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1392562     Document Type: Article

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