Advanced CVD barrier technology for copper interconnect

Materials Research Society Symposium - Proceedings

Volumn 564, Issue , 1999, Pages 269-280

  Jain, A ^a   Adetutu, O ^a   Ekstrom, B ^a   Hamilton, G ^a   Herrick, M ^a   Venkatraman, R ^a   Weitzman, E ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER; DIELECTRIC MATERIALS; DIFFUSION IN SOLIDS; RELIABILITY;

DIFFUSION BARRIERS;

ELECTRIC CONTACTS;

EID: 0033279722     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-564-269     Document Type: Article

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