Electroless CoWP barrier/protection layer deposition for Cu metallization

Materials Research Society Symposium - Proceedings

Volumn 451, Issue , 1997, Pages 463-468

  Lopatin, S ^a   Shacham Diamand, Y ^a   Dubin, V ^a   Vasudev, P K ^a   Pellerin, J ^a   Zhao, B ^a  

^a Department of Obstetrics Gynecology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CATALYSTS; COPPER; DEPOSITION; ELECTRIC CONDUCTIVITY OF SOLIDS; METALLIZING; REACTION KINETICS; SURFACE ROUGHNESS;

ELECTROLESS BARRIER/PROTECTION LAYERS;

COBALT COMPOUNDS;

EID: 0030700158     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)