Experimental and analytical study on the flow of encapsulant during underfill encapsulation of flip-chips

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 327-334

  Han, Sejin ^a   Wang, K K ^a   Cho, Sung Yong ^a  

^a Department of Obstetrics Gynecology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; CALCULATIONS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; ENCAPSULATION; FINITE ELEMENT METHOD; KINETIC THEORY; MATHEMATICAL MODELS; NUMERICAL METHODS; SURFACE TENSION; VISCOMETERS; VISCOSITY;

GENERALIZED HELE-SHAW METHOD; OSCILLATORY PARALLEL PLATE TYPE VISCOMETER; SURFACE TENSION COEFFICIENT; UNDERFILL ENCAPSULATION;

FLIP CHIP DEVICES;

EID: 0029696516     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (16)