Compression flow modeling of underfill encapsulants for low cost flip chip assembly

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 463-470

  Pascarella, N W ^a   Baldwin, D F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FLIP CHIP DEVICES; NETWORK COMPONENTS; RESIN TRANSFER MOLDING; CAPILLARY FLOW; COMPRESSIBLE FLOW; COMPUTER SIMULATION; COST EFFECTIVENESS; ENCAPSULATION; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; STANDARDS; VISCOSITY;

ADVANCED PROCESS; FLIP CHIP ASSEMBLIES; PLACEMENT PROCESS; PROCESS PARAMETERS; SIMULATION STUDIES; SOLDER INTERCONNECT; UNDERFILL ENCAPSULANTS; UNDERFILL MATERIALS;

COST REDUCTION; ELECTRONICS PACKAGING;

COMPRESSION FLOW CHIPS; UNDERFILL DISPENSE PROCESSES;

EID: 0031630756     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678735     Document Type: Conference Paper

References (5)

1. Baldwin, D., Pascarella, N., "Manufacturability of Underfill Processing for Low Cost Flip Chip", ASME International Congress and Expo., Dallas, TX, November, 1997.
2. Han, S., Wang, K., Cho, S., "Experimental and Analytical Study on the Flow of Encapsulant During Underfill Encapsulation of Flip-Chips", Proc 46th Electronic Components and Technology Conf., Orlando, FL, May 1996, pp. 327-334.
3. Pascarella, N., Baldwin, D., "Advanced Encapsulation Processing for Low Cost Electronics Assembly-A Cost Analysis", 3rd International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties, Interfaces, Braselton, GA, March 1997, pp. 50-53.
4. Pascarella, N., Baldwin, D., "Advanced Encapsulation Processing for Low Cost Electronics Assembly-A Cost Analysis", Advances in Electronic Packaging-ASME INTERpack '97, Vol. 19-1, June 1997, pp. 359-363.
5. Pascarella, N. W., Advanced Encapsulation Processing for Low Cost Electronics Assembly. Master's Thesis, Georgia Institute of Technology, September, 1997.