How to select underfill materials for solder bumped flip chips on low cost substrates?

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 693-700

  Lau, John H ^a   Chang, Chris ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; FILLERS; FLIP CHIP DEVICES; MOISTURE; POLYCHLORINATED BIPHENYLS; SHEAR STRENGTH; SOLDERING; SUBSTRATES; THERMOGRAVIMETRIC ANALYSIS;

SOLDER BUMPED FLIP CHIPS; UNDERFILL MATERIALS;

ELECTRONICS PACKAGING;

EID: 0032319748     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)