-
1
-
-
0001606630
-
Firehose architectures for free-space optically interconnected VLSI circuits
-
A. V. Krishnamoorthy and D. A. B. Miller, "Firehose architectures for free-space optically interconnected VLSI circuits," J. Parallel and Distributed Computing, vol. 41, pp. 109-114, 1997.
-
(1997)
J. Parallel and Distributed Computing
, vol.41
, pp. 109-114
-
-
Krishnamoorthy, A.V.1
Miller, D.A.B.2
-
2
-
-
0024054609
-
Architectural considerations for pholonic switching networks
-
Sept.
-
H. S. Hinton, "Architectural considerations for pholonic switching networks," IEEE J. Select. Areas. Commun., vol. 6, pp. 1209-1226, Sept.. 1988.
-
(1988)
IEEE J. Select. Areas. Commun.
, vol.6
, pp. 1209-1226
-
-
Hinton, H.S.1
-
3
-
-
0024645632
-
Programmable optoelectronic multiprocessors and their comparison with symbolic substitution for digital optical computing
-
Apr.
-
F. Kiamilev, S. C. Esener, R. Paturi. Y. Fainman, P. Mercier, C. C. Guest, and S. H. Lee, "Programmable optoelectronic multiprocessors and their comparison with symbolic substitution for digital optical computing." Opt. Eng., vol. 28, no. 4. pp. 396-408. Apr. 1989.
-
(1989)
Opt. Eng.
, vol.28
, Issue.4
, pp. 396-408
-
-
Kiamilev, F.1
Esener, S.C.2
Paturi, R.3
Fainman, Y.4
Mercier, P.5
Guest, C.C.6
Lee, S.H.7
-
4
-
-
0030114091
-
Scaling optoelectronic-VLSI circuits into the 21st century: A technology roadmap
-
Apr.
-
A. V. Krishnamoorthy and D. A. B. Miller, "Scaling optoelectronic-VLSI circuits into the 21st century: A technology roadmap," IEEE J. Select. Topics Quantum Electron., vol. 2, pp. 55-76, Apr. 1996.
-
(1996)
IEEE J. Select. Topics Quantum Electron.
, vol.2
, pp. 55-76
-
-
Krishnamoorthy, A.V.1
Miller, D.A.B.2
-
5
-
-
84889230794
-
Special Issue on massively parallel optical interconnects
-
Jan.
-
J. W. Goodman and E. Schenfeld. Eds., Special Issue on massively parallel optical interconnects. Appl. Opt., vol. 37, no. 2, Jan. J998.
-
Appl. Opt.
, vol.37
, Issue.2
-
-
Goodman, J.W.1
Schenfeld, E.2
-
7
-
-
0029327780
-
Digital free-space optical interconnections: A comparison of transmitter technologies
-
C. Fan, B. Mansoorian. D. A. Van Blerkom, M. W. Hansen, V. H. Ozguz. S. C. Esener. and G. C. Marsden. "Digital free-space optical interconnections: A comparison of transmitter technologies." Appl. Opt., vol. 34. pp. 3103-3115. 1995.
-
(1995)
Appl. Opt.
, vol.34
, pp. 3103-3115
-
-
Fan, C.1
Mansoorian, B.2
Van Blerkom, D.A.3
Hansen, M.W.4
Ozguz, V.H.5
Esener, S.C.6
Marsden, G.C.7
-
8
-
-
0001690076
-
Performance comparison between multiple-quantum-well modulator-based and vertical-cavity-surface-emitting laser-based smart pixels
-
Mar.
-
T. Nakahara. S. Matsuo. S. Fukushima, and T. Kurokawa, "Performance comparison between multiple-quantum-well modulator-based and vertical-cavity-surface-emitting laser-based smart pixels," Appl. Opt., vol. 35. pp. 860-871. Mar. 1996.
-
(1996)
Appl. Opt.
, vol.35
, pp. 860-871
-
-
Nakahara, T.1
Matsuo, S.2
Fukushima, S.3
Kurokawa, T.4
-
9
-
-
0029343437
-
1 Gb/s two-beam transimpedance smart-pixel optical receivers made from hybrid GaAs MQW modulators bonded to 0.8 pm silicon CMOS
-
July
-
T. K. Woodward. A. V. Krishnamoorthy, A. L. Lentine, K. W. Goossen, J. A. Walker. J. E. Cunningham, W. Y. Jan, L. A. D'Asaro. L. M. F. Chirovsky, S. P. Hui. B. Tseng. D. Kossives, D. Dahringer. and R. Leibenguth, "1 Gb/s two-beam transimpedance smart-pixel optical receivers made from hybrid GaAs MQW modulators bonded to 0.8 pm silicon CMOS," IEEE Photon. Technol. Lett., vol. 7, no. 7. pp. 763-765, July 1995.
-
(1995)
IEEE Photon. Technol. Lett.
, vol.7
, Issue.7
, pp. 763-765
-
-
Woodward, T.K.1
Krishnamoorthy, A.V.2
Lentine, A.L.3
Goossen, K.W.4
Walker, J.A.5
Cunningham, J.E.6
Jan, W.Y.7
D'Asaro, L.A.8
Chirovsky, L.M.F.9
Hui, S.P.10
Tseng, B.11
Kossives, D.12
Dahringer, D.13
Leibenguth, R.14
-
10
-
-
0031130272
-
Progress in optoelectronic-VLSI smart pixel technology based on GaAs/AlGaAs MQW modulators
-
A. V. Krishnamoorthy and K. W. Goossen, "Progress in optoelectronic-VLSI smart pixel technology based on GaAs/AlGaAs MQW modulators." Int. J. Optoelectron., vol. 11, no. 3. pp. 181-198. 1997.
-
(1997)
Int. J. Optoelectron.
, vol.11
, Issue.3
, pp. 181-198
-
-
Krishnamoorthy, A.V.1
Goossen, K.W.2
-
11
-
-
0031188336
-
Optoelectronic-VLSI packaging with polarization-selective computer-generated holograms
-
July
-
F. Xu, Y. Fainman, J. E. Ford, and A. V. Krishnamoorthy, "Optoelectronic-VLSI packaging with polarization-selective computer-generated holograms," Opt. Lett., vol. 22, no. 14. pp. 1095-1097, July 1997.
-
(1997)
Opt. Lett.
, vol.22
, Issue.14
, pp. 1095-1097
-
-
Xu, F.1
Fainman, Y.2
Ford, J.E.3
Krishnamoorthy, A.V.4
-
12
-
-
0027540855
-
1-xAs field-effect transistor-self-electro-optic effect device (FET-SEED) smart pixel arrays
-
Feb.
-
1-xAs field-effect transistor-self-electro-optic effect device (FET-SEED) smart pixel arrays," IEEE J. Quantum Electron., vol. 29, pp. 670-677, Feb. 1993.
-
(1993)
IEEE J. Quantum Electron.
, vol.29
, pp. 670-677
-
-
D'Asaro, L.A.1
Chirovsky, L.M.F.2
Laskowski, E.J.3
Pei, S.S.4
Woodward, T.K.5
Lentine, A.L.6
Leibenguth, R.E.7
Focht, M.W.8
Freund, J.M.9
Guth, G.G.10
Smith, L.E.11
-
13
-
-
0029309853
-
Monolithic optoelectronic circuit design and fabrication by epitaxial growth on commercial VLSI GaAs MESFET's
-
K. V. Shenoy, C. G. Fonstad, Jr., A. C. Grot, and D. Psaltis. "Monolithic optoelectronic circuit design and fabrication by epitaxial growth on commercial VLSI GaAs MESFET's," IEEE Photon. Technol. Lett., vol. 7, pp. 508-510, 1995.
-
(1995)
IEEE Photon. Technol. Lett.
, vol.7
, pp. 508-510
-
-
Shenoy, K.V.1
Fonstad Jr., C.G.2
Grot, A.C.3
Psaltis, D.4
-
14
-
-
0029394537
-
Monolithically integrated photonic switch device using an MSM PD, MESFET's, and a VCSEL
-
S. Matsuo, T. Nakahara, Y. Kohama. Y. Ohiso, S. Fukushima, and T. Kurokawa, "Monolithically integrated photonic switch device using an MSM PD, MESFET's, and a VCSEL." IEEE Photon. Technol. Lett., vol. 7, pp. 1165-1167, 1995,
-
(1995)
IEEE Photon. Technol. Lett.
, vol.7
, pp. 1165-1167
-
-
Matsuo, S.1
Nakahara, T.2
Kohama, Y.3
Ohiso, Y.4
Fukushima, S.5
Kurokawa, T.6
-
15
-
-
0030290140
-
Room temperature photopumped operation of 1.58 μm vertical-cavity lasers fabricated on Si substrates using wafer bonding
-
Mar.
-
H. Wada. T. Takamori. and T. Kamijoh, "Room temperature photopumped operation of 1.58 μm vertical-cavity lasers fabricated on Si substrates using wafer bonding," IEEE Photon. Technol. Lett., vol. 8, pp. 181-198, Mar. 1997.
-
(1997)
IEEE Photon. Technol. Lett.
, vol.8
, pp. 181-198
-
-
Wada, H.1
Takamori, T.2
Kamijoh, T.3
-
16
-
-
0030217345
-
Submilliamp long-wavelength vertical cavity llasers
-
Aug.
-
N. M. Margalit, D. I. Babic, K. Streubel, R. P. Mirin, R. L. Naone, J. E. Bowers, and E. L. Hu, "Submilliamp long-wavelength vertical cavity llasers." Electron. Lett., vol. 32, pp. 1675-1677, Aug. 1996.
-
(1996)
Electron. Lett.
, vol.32
, pp. 1675-1677
-
-
Margalit, N.M.1
Babic, D.I.2
Streubel, K.3
Mirin, R.P.4
Naone, R.L.5
Bowers, J.E.6
Hu, E.L.7
-
17
-
-
0031153460
-
Wafer-bonding technology and its applications in optoelectronic devices and materials
-
Z. H. Zhu, F. E. Ejeckam, Y. Qian, J. Zhang, G. L. Christenson, and Y. H. Lo, "Wafer-bonding technology and its applications in optoelectronic devices and materials," IEEE J. Select. Topics Quantum Electron., vol. 3, pp. 927-936, 1997.
-
(1997)
IEEE J. Select. Topics Quantum Electron.
, vol.3
, pp. 927-936
-
-
Zhu, Z.H.1
Ejeckam, F.E.2
Qian, Y.3
Zhang, J.4
Christenson, G.L.5
Lo, Y.H.6
-
18
-
-
0031167761
-
Use of polyimide bonding for hybrid integration of a vertical cavity surface emitting laser on a silicon substrate
-
S. Matsuo, K. Tateno, T. Nakahara, H. Tsuda, and T. Kurokawa, "Use of polyimide bonding for hybrid integration of a vertical cavity surface emitting laser on a silicon substrate," Electron. Lett., vol. 33, pp. 1148-1149, 1997.
-
(1997)
Electron. Lett.
, vol.33
, pp. 1148-1149
-
-
Matsuo, S.1
Tateno, K.2
Nakahara, T.3
Tsuda, H.4
Kurokawa, T.5
-
19
-
-
0028445213
-
Fluidic self-assembly for the integration of GaAs light-emitting diodes on Si substrates
-
June
-
H.-J. J. Yeh, and J. S. Smith, "Fluidic self-assembly for the integration of GaAs light-emitting diodes on Si substrates," IEEE Photon. Technol. Lett., vol. 6, pp. 706-708, June 1994.
-
(1994)
IEEE Photon. Technol. Lett.
, vol.6
, pp. 706-708
-
-
Yeh, H.-J.J.1
Smith, J.S.2
-
20
-
-
0029354571
-
Fluidic self-assembly of InGaAs vertical-cavity surface-emitting lasers onto Silicon
-
Aug.
-
J. K. Tu, J. J. Talghader, M. A. Hadley, and J. S. Smith, "Fluidic self-assembly of InGaAs vertical-cavity surface-emitting lasers onto Silicon." Electron. Lett., vol. 31, pp. 1448-1449, Aug. 1995.
-
(1995)
Electron. Lett.
, vol.31
, pp. 1448-1449
-
-
Tu, J.K.1
Talghader, J.J.2
Hadley, M.A.3
Smith, J.S.4
-
21
-
-
84889202405
-
DNA assisted assembly of photonic devices and crystals, in OSA TOPS
-
Washington, DC: Opt. Soc. Amer.
-
|21] S. C. Esener, D. Hartmann, S. Guncer, C. Fan, M. J. Heller, and J. Cable, "DNA assisted assembly of photonic devices and crystals," in OSA TOPS: Spatial Light Modulators, Washington, DC: Opt. Soc. Amer., 1997, vol. 14.
-
(1997)
Spatial Light Modulators
, vol.14
-
-
Esener, S.C.1
Hartmann, D.2
Guncer, S.3
Fan, C.4
Heller, M.J.5
Cable, J.6
-
22
-
-
36549092991
-
Van der Waals bonding of GaAs epitaxial liftoff films onto arbitrary substrates
-
E. Yablonovitch. D. M. Hwang, T. J. Gmitter, L. T. Florez, and J. P. Harbison, "Van der Waals bonding of GaAs epitaxial liftoff films onto arbitrary substrates," Appl. Phys. Lett., vol. 56, pp. 2419-2421, 1990.
-
(1990)
Appl. Phys. Lett.
, vol.56
, pp. 2419-2421
-
-
Yablonovitch, E.1
Hwang, D.M.2
Gmitter, T.J.3
Florez, L.T.4
Harbison, J.P.5
-
23
-
-
0025388551
-
Epitaxial lift-off GaAs LED's to Si for fabrication of optoelectronic integrated circuits
-
I. Pollentier, P. Demeester, A. Ackaert, L. Buydens, P. Van Daele, and R. Baets, "Epitaxial lift-off GaAs LED's to Si for fabrication of optoelectronic integrated circuits," Electron. Lett., vol. 26, pp. 193-194, 1990.
-
(1990)
Electron. Lett.
, vol.26
, pp. 193-194
-
-
Pollentier, I.1
Demeester, P.2
Ackaert, A.3
Buydens, L.4
Van Daele, P.5
Baets, R.6
-
24
-
-
0026923827
-
Vertical electrical interconnection of compound semiconductor thin-films to underlying silicon circuitry
-
C. Camperi-Ginestet, Y. W. Kim, N. M. Jokerst, M. G. Allen, and M. A. Brooke, "Vertical electrical interconnection of compound semiconductor thin-films to underlying silicon circuitry," IEEE Photon. Technol. Lett., vol. 4, pp. 1003-1005, 1992.
-
(1992)
IEEE Photon. Technol. Lett.
, vol.4
, pp. 1003-1005
-
-
Camperi-Ginestet, C.1
Kim, Y.W.2
Jokerst, N.M.3
Allen, M.G.4
Brooke, M.A.5
-
25
-
-
0027589243
-
Alignable liftoff transfer of device arrays via a single polymeric carrier membrane
-
J. J. Callahan, K. P. Martin. T. J. Drabik, B. B. Quimby. and C. Fan, "Alignable liftoff transfer of device arrays via a single polymeric carrier membrane," Electron. Lett., vol. 29, pp. 951-952. 1993.
-
(1993)
Electron. Lett.
, vol.29
, pp. 951-952
-
-
Callahan, J.J.1
Martin, K.P.2
Drabik, T.J.3
Quimby, B.B.4
Fan, C.5
-
26
-
-
0031191924
-
A vertical-cavity surface-emitting laser appliquéd to a 0.8-μm NMOS driver
-
July
-
D. L. Mathine, R. Droopad, and G. N. Maracas, "A vertical-cavity surface-emitting laser appliquéd to a 0.8-μm NMOS driver," IEEE Photon. Technol. Lett., vol. 9, pp. 869-871, July 1997.
-
(1997)
IEEE Photon. Technol. Lett.
, vol.9
, pp. 869-871
-
-
Mathine, D.L.1
Droopad, R.2
Maracas, G.N.3
-
27
-
-
0031144706
-
Thermosonic bonding of an optical transceiver based on an 8 × 8 vertical-cavity surface-emitting laser array
-
T. S. McLaren, S. Y. Kang, W. G. Zhang, T. H. Ju, and Y. C. Lee, "Thermosonic bonding of an optical transceiver based on an 8 × 8 vertical-cavity surface-emitting laser array," IEEE Trans. Comp. Packag. Manufact Technol. B, vol. 20, pp. 152-160, 1997.
-
(1997)
IEEE Trans. Comp. Packag. Manufact Technol. B
, vol.20
, pp. 152-160
-
-
McLaren, T.S.1
Kang, S.Y.2
Zhang, W.G.3
Ju, T.H.4
Lee, Y.C.5
-
28
-
-
0026406130
-
Optoelectronic component arrays for optical interconnection of circuits and subsystems
-
Dec.
-
M. J. Goodwin, A. J. Moseley, M. Q. Kearley, R. C. Morris, C. J. G. Kirkby, J. Thompson, R. C. Goodfellow, and I. Bennion, "Optoelectronic component arrays for optical interconnection of circuits and subsystems," J Lightwave Technol., vol. 9, pp. 1639-1645. Dec. 1991.
-
(1991)
J Lightwave Technol.
, vol.9
, pp. 1639-1645
-
-
Goodwin, M.J.1
Moseley, A.J.2
Kearley, M.Q.3
Morris, R.C.4
Kirkby, C.J.G.5
Thompson, J.6
Goodfellow, R.C.7
Bennion, I.8
-
29
-
-
84939365627
-
Design and implementation of flip-chip bonded Si/PLZI smart pixels
-
Santa Barbara, CA, Aug. paper MC2
-
B. Mansoorian, V. Ozguz, C. Fan, and S. Esener, "Design and implementation of flip-chip bonded Si/PLZI smart pixels," in Proc. IEEE LEOS Summer Top. Meeting Smart Pixels, Santa Barbara, CA, Aug. 1992, paper MC2.
-
(1992)
Proc. IEEE LEOS Summer Top. Meeting Smart Pixels
-
-
Mansoorian, B.1
Ozguz, V.2
Fan, C.3
Esener, S.4
-
30
-
-
3042888656
-
Flip-chip bonding optimizes opto-IC's
-
Nov.
-
M. Wale and M. Goodwin, "Flip-chip bonding optimizes opto-IC's," IEEE Circuits Devices Mag., pp. 25-31. Nov. 1992.
-
(1992)
IEEE Circuits Devices Mag.
, pp. 25-31
-
-
Wale, M.1
Goodwin, M.2
-
31
-
-
0027627246
-
GaAs 850 modulators solder-bonded to silicon
-
July
-
K. W. Goossen, J. E. Cunningham, and W. Y. Jan, "GaAs 850 modulators solder-bonded to silicon." IEEE Photon. Technol. Lett., vol. 5, pp. 776-778. July 1993.
-
(1993)
IEEE Photon. Technol. Lett.
, vol.5
, pp. 776-778
-
-
Goossen, K.W.1
Cunningham, J.E.2
Jan, W.Y.3
-
32
-
-
30844438132
-
High-performance interconnects for on-chip device integration
-
Oct.
-
A. E. Kaloyeros, S. Luryi, J. G. Ryan, and J. J. Sullivan. "High-performance interconnects for on-chip device integration," Semiconduct. Int., pp. 115-122, Oct. 1997.
-
(1997)
Semiconduct. Int.
, pp. 115-122
-
-
Kaloyeros, A.E.1
Luryi, S.2
Ryan, J.G.3
Sullivan, J.J.4
-
33
-
-
0029290641
-
GaAs MQW modulators integrated with silicon CMOS
-
Apr.
-
K. W. Goossen, J. A. Walker, L. A. D'Asaro, S. P. Hui, B. Tseng, R. Leibenguth, D. Kossives, D. D. Bacon, D. Dahringer, L. M. F. Chirovsky, A. L. Lentine, and D. A. B. Miller, "GaAs MQW modulators integrated with silicon CMOS," IEEE Photon. Technol. Lett., vol. 7, pp. 360-362. Apr. 1995.
-
(1995)
IEEE Photon. Technol. Lett.
, vol.7
, pp. 360-362
-
-
Goossen, K.W.1
Walker, J.A.2
D'Asaro, L.A.3
Hui, S.P.4
Tseng, B.5
Leibenguth, R.6
Kossives, D.7
Bacon, D.D.8
Dahringer, D.9
Chirovsky, L.M.F.10
Lentine, A.L.11
Miller, D.A.B.12
-
34
-
-
0030101664
-
Large arrays of spatial light modulators hybridized to silicon integrated circuits
-
Mar.
-
T. L. Worchesky. K. J. Ritter, R. Martin, and B. Lane. "Large arrays of spatial light modulators hybridized to silicon integrated circuits," Appl. Opt., vol. 35. no. 8, pp. 1180-86. Mar. 1996.
-
(1996)
Appl. Opt.
, vol.35
, Issue.8
, pp. 1180-1186
-
-
Worchesky, T.L.1
Ritter, K.J.2
Martin, R.3
Lane, B.4
-
35
-
-
0030243266
-
Flip-chip bonded 0.85 μm bottom-emitting vertical-cavity laser array on an AlGaAs substrate,μ
-
Y. Ohiso, K. Tateno, Y. Kohama, A. Wakatsuki, H. Tsunetsugu, and T. Kurokawa. "Flip-chip bonded 0.85 μm bottom-emitting vertical-cavity laser array on an AlGaAs substrate,μ IEEE Photon. Technol Lett., vol. 8, pp. 1115-1117, 1996.
-
(1996)
IEEE Photon. Technol Lett.
, vol.8
, pp. 1115-1117
-
-
Ohiso, Y.1
Tateno, K.2
Kohama, Y.3
Wakatsuki, A.4
Tsunetsugu, H.5
Kurokawa, T.6
-
36
-
-
3843128620
-
A 16 " 16 vertical-cavity surface-emitting laser array module for optical processing and interconnect applications
-
Lake Tahoe, NV, Mar. post deadline paper PD-I
-
D. Paananen, J. Wasserbauer, F. Scott, P. Brusenbach, D. Lewis, and G. Simonis, μA 16 " 16 vertical-cavity surface-emitting laser array module for optical processing and interconnect applications,× in Proc. OSA Top. Meeting Optics in Computing, Lake Tahoe, NV, Mar. 1997, post deadline paper PD-I.
-
(1997)
Proc. OSA Top. Meeting Optics in Computing
-
-
Paananen, D.1
Wasserbauer, J.2
Scott, F.3
Brusenbach, P.4
Lewis, D.5
Simonis, G.6
-
37
-
-
0031131135
-
Foundry-fabricated array of smart pixels integrating MESFETS/MSM's and VCSEL's
-
E. M. Hayes, R. Jurrat. R. Pu, R. D. Snyder. S. A. Feld, P. Stanko, C. W. Wilmsen, K. D. Choquette. K. M. Geib, and H. Q. Hou, ×Foundry-fabricated array of smart pixels integrating MESFETS/MSM's and VCSEL's,× Int. J. Optoelectron., vol. 11, no. •": 3, pp. 229-237, 1997.
-
(1997)
Int. J. Optoelectron.
, vol.11
, Issue.3
, pp. 229-237
-
-
Hayes, E.M.1
Jurrat, R.2
Pu, R.3
Snyder, R.D.4
Feld, S.A.5
Stanko, P.6
Wilmsen, C.W.7
Choquette, K.D.8
Geib, K.M.9
Hou, H.Q.10
-
38
-
-
84889223450
-
Vertical-cavity surface-emitting lasers flip-chip bonded to Gb/s CMOS circuits
-
Monterey, CA, July postdeadline paper PD004
-
A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibenguth, S. P. Hui, G. J. Zydzik. K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker. J. E. Cunningham, and L. A. D'Asaro, "Vertical-cavity surface-emitting lasers flip-chip bonded to Gb/s CMOS circuits," in Tech. Dig. IEEE Summer Topical Meeting Smart Pixels, Monterey, CA, July 1998. postdeadline paper PD004.
-
(1998)
Tech. Dig. IEEE Summer Topical Meeting Smart Pixels
-
-
Krishnamoorthy, A.V.1
Chirovsky, L.M.F.2
Hobson, W.S.3
Leibenguth, R.E.4
Hui, S.P.5
Zydzik, G.J.6
Goossen, K.W.7
Wynn, J.D.8
Tseng, B.J.9
Lopata, J.10
Walker, J.A.11
Cunningham, J.E.12
D'Asaro, L.A.13
-
39
-
-
0029388146
-
Ring oscillators with optical and electrical readout based on hybrid GaAs MQW modulators bonded to 0.8 micron silicon VLSI circuits
-
Oct.
-
A. Krishnamoorthy, T. Woodward, R. Novotny K. Goossen, J. Walker, A. Lentine, L. D'Asaro, S. Hui, B. Tseng, R. Leibenguth. D. Kossives, D. Dahringer, L. Chirovsky, G. Aplin, R. Rozier, F. Kiamilev, and D. Miller. "Ring oscillators with optical and electrical readout based on hybrid GaAs MQW modulators bonded to 0.8 micron silicon VLSI circuits," Electron. Lett., vol. 31, no. 22, pp. 1917-18, Oct. 1995.
-
(1995)
Electron. Lett.
, vol.31
, Issue.22
, pp. 1917-1918
-
-
Krishnamoorthy, A.1
Woodward, T.2
Novotny, R.3
Goossen, K.4
Walker, J.5
Lentine, A.6
D'Asaro, L.7
Hui, S.8
Tseng, B.9
Leibenguth, R.10
Kossives, D.11
Dahringer, D.12
Chirovsky, L.13
Aplin, G.14
Rozier, R.15
Kiamilev, F.16
Miller, D.17
-
40
-
-
0028517215
-
Experimental sensitivity studies of diode-clamped FET-SEED smart-pixel optical receivers
-
Oct.
-
T. K. Woodward, A. L. Lentine, and L. M. F. Chirovsky, "Experimental sensitivity studies of diode-clamped FET-SEED smart-pixel optical receivers," IEEE J. Quantum Electron., vol. 30, pp. 2319-2324, Oct. 1994.
-
(1994)
IEEE J. Quantum Electron.
, vol.30
, pp. 2319-2324
-
-
Woodward, T.K.1
Lentine, A.L.2
Chirovsky, L.M.F.3
-
41
-
-
0029409492
-
3-D integration of MQW modulators over active sub-micron CMOS circuits: 375 Mb/s transimpedance receiver-transmitter circuit
-
Nov.
-
A. V. Krishnamoorthy, A. L. Lentine, K. W. Goossen, J. A. Walker, T. K. Woodward, J. E. Ford, G. F. Aplin, L. A. D'Asaro, S. P. Hui, B. Tseng, R. Leibenguth, D. Kossives, D. Dahringer, L. M. F. Chirovsky, and D. A. B. Miller, "3-D integration of MQW modulators over active sub-micron CMOS circuits: 375 Mb/s transimpedance receiver-transmitter circuit," IEEE Photon. Technol. Lett., vo. 7, pp. 1288-1290, Nov. 1995.
-
(1995)
IEEE Photon. Technol. Lett.
, vol.7
, pp. 1288-1290
-
-
Krishnamoorthy, A.V.1
Lentine, A.L.2
Goossen, K.W.3
Walker, J.A.4
Woodward, T.K.5
Ford, J.E.6
Aplin, G.F.7
D'Asaro, L.A.8
Hui, S.P.9
Tseng, B.10
Leibenguth, R.11
Kossives, D.12
Dahringer, D.13
Chirovsky, L.M.F.14
Miller, D.A.B.15
-
42
-
-
7244242177
-
Photonic page buffer based on GaAs MQW modulators bonded directly over active silicon CMOS circuits
-
May
-
A. V. Krishnamoorthy, J. E. Ford, K. W. Goossen, J. A. Walker, A. L. Lentine, L. A. D'Asaro, S. P. Hui, B. Tseng. R. Leibenguth. D. Kossives, D. Dahringer, L. M. F. Chirovsky, F. E. Kiamilev, G. F. Aplin, R. G. Rozier, and D. A. B. Miller, "Photonic page buffer based on GaAs MQW modulators bonded directly over active silicon CMOS circuits," Appl. Opt., vol. 35, no. 14, pp. 2439-2448, May 1996.
-
(1996)
Appl. Opt.
, vol.35
, Issue.14
, pp. 2439-2448
-
-
Krishnamoorthy, A.V.1
Ford, J.E.2
Goossen, K.W.3
Walker, J.A.4
Lentine, A.L.5
D'Asaro, L.A.6
Hui, S.P.7
Tseng, B.8
Leibenguth, R.9
Kossives, D.10
Dahringer, D.11
Chirovsky, L.M.F.12
Kiamilev, F.E.13
Aplin, G.F.14
Rozier, R.G.15
Miller, D.A.B.16
-
43
-
-
0026381433
-
Performance comparison between optoelectronic and VLSI multistage interconnection networks
-
Dec.
-
F. E. Kiamilev, P. J. Mar.and, A. V. Krishnamoorthy, S. C. Esener, and S. H. Lee, "Performance comparison between optoelectronic and VLSI multistage interconnection networks," J. Lightwave Technol., vol. 9, pp. 1674-1692, Dec. 1991.
-
(1991)
J. Lightwave Technol.
, vol.9
, pp. 1674-1692
-
-
Kiamilev, F.E.1
Mar, P.J.2
Krishnamoorthy, A.V.3
Esener, S.C.4
Lee, S.H.5
-
44
-
-
84975598757
-
Grain-size considerations for optoelectronic multistage interconnection networks
-
Sept.
-
A. V. Krishnamoorthy, P. J. Mar.and. F. E. Kiamilev, and S. C. Esener, "Grain-size considerations for optoelectronic multistage interconnection networks," Appl. Opt., vol. 31. no. 26. pp. 5480-5507. Sept. 1992.
-
(1992)
Appl. Opt.
, vol.31
, Issue.26
, pp. 5480-5507
-
-
Krishnamoorthy, A.V.1
Mar, P.J.2
Kiamilev, F.E.3
Esener, S.C.4
-
45
-
-
0028441872
-
Elements of a hybrid interconnection theory
-
H. M. Ozaktas and J. W. Goodman, "Elements of a hybrid interconnection theory," Appl. Opt., vol. 33, pp. 2968-2987. 1994.
-
(1994)
Appl. Opt.
, vol.33
, pp. 2968-2987
-
-
Ozaktas, H.M.1
Goodman, J.W.2
-
46
-
-
84975597955
-
Optical imaging applied to microelectric chip-to-chip interconnections
-
R. K. Kostuk J. W. Goodman, and L. Hesselink, "Optical imaging applied to microelectric chip-to-chip interconnections," Appl. Opt., vol. 24. pp. 2851-2858. 1985.
-
(1985)
Appl. Opt.
, vol.24
, pp. 2851-2858
-
-
Kostuk, R.K.1
Goodman, J.W.2
Hesselink, L.3
-
47
-
-
0002319085
-
Optically augmented 3-D computer: System technology and architecture
-
P. J. Marchand, A. V. Krishnamoorthy, G. I. Yayla, S. C. Esener, and U. Efron, "Optically augmented 3-D computer: System technology and architecture," J. Parallel and Distributed Computing., vol. 41, pp. 20-52, 1997.
-
(1997)
J. Parallel and Distributed Computing
, vol.41
, pp. 20-52
-
-
Marchand, P.J.1
Krishnamoorthy, A.V.2
Yayla, G.I.3
Esener, S.C.4
Efron, U.5
-
48
-
-
0031701866
-
Speed and energy analysis of digital interconnections: Comparison of on-chip, off-chip, and free-space technologies
-
G. I. Yayla, P. J. Marchand, and S. C. Esener, "Speed and energy analysis of digital interconnections: Comparison of on-chip, off-chip, and free-space technologies," Appl. Opt., vol. 37, no. 2. pp. 205-227, 1998.
-
(1998)
Appl. Opt.
, vol.37
, Issue.2
, pp. 205-227
-
-
Yayla, G.I.1
Marchand, P.J.2
Esener, S.C.3
-
49
-
-
0003479594
-
-
Reading, MA: Addison-Wesley, ch. 6
-
H. B. Bakoglu, Circuits, Interconnections, and Packaging for VLSI. Reading, MA: Addison-Wesley, 1990, ch. 6.
-
(1990)
Circuits, Interconnections, and Packaging for VLSI
-
-
Bakoglu, H.B.1
-
51
-
-
0002435274
-
Limit to the bit-rate capacity of electrical interconnects from the aspect ratio of the system architecture
-
D. A. B. Miller and H. M. Ozaktas, "Limit to the bit-rate capacity of electrical interconnects from the aspect ratio of the system architecture." J. Parallel and Distributed Computing, vol. 41. pp. 42-52. 1997.
-
(1997)
J. Parallel and Distributed Computing
, vol.41
, pp. 42-52
-
-
Miller, D.A.B.1
Ozaktas, H.M.2
-
53
-
-
0024072983
-
Performance limits of electrical interconnections to a highspeed chip
-
Sept.
-
A, J. Rainai. "Performance limits of electrical interconnections to a highspeed chip." IEEE Trans. Coinp. Hybrids. Manufact. Technol., vol. 11. pp. 260-266. Sept. 1988.
-
(1988)
IEEE Trans. Coinp. Hybrids. Manufact. Technol.
, vol.11
, pp. 260-266
-
-
Rainai, A.J.1
-
54
-
-
0026021565
-
Overshoot-controlled RLC interconnections
-
Jan.
-
J. R. Brews. "Overshoot-controlled RLC interconnections." IEEE Trans. Electron Devices, vol. 38. pp. 76-87. Jan. 1991.
-
(1991)
IEEE Trans. Electron Devices
, vol.38
, pp. 76-87
-
-
Brews, J.R.1
-
55
-
-
0022314480
-
Electrical characterization of packages for high-speed integrated circuits
-
Dec.
-
C. J. Stanghan and B. M. Macdonald. "Electrical characterization of packages for high-speed integrated circuits." IEEE Trans. Comp. Hybrids Manufact. Technol., vol. CHMT-8. pp. 468-473, Dec. 1985.
-
(1985)
IEEE Trans. Comp. Hybrids Manufact. Technol.
, vol.CHMT-8
, pp. 468-473
-
-
Stanghan, C.J.1
Macdonald, B.M.2
-
56
-
-
0026190523
-
Interconnection delay in very high-speed VLSI
-
July
-
D. Zhou, F. P. Preparata. and S. M. Kang, "Interconnection delay in very high-speed VLSI," IEEE Trans. Circuits Syst., vol. 38. pp. 779-789, July 1991.
-
(1991)
IEEE Trans. Circuits Syst.
, vol.38
, pp. 779-789
-
-
Zhou, D.1
Preparata, F.P.2
Kang, S.M.3
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