The microstructure of submicrometer wide planar-reactive ion etched versus trench-damascene AlCu lines

Journal of Applied Physics

Volumn 88, Issue 9, 2000, Pages 5093-5099

  Rodbell, K P ^a   Gignac, L M ^a   Hurd, J L ^b   Filippi, R ^b   Wang, Yun Yu ^b   Clevenger, L A ^c   Iggulden, R C ^c   Schnabel, R F ^c   Weber, S ^c  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

^c IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0012879252     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1314612     Document Type: Article

References (30)

1. D. P. Tracy, D. B. Knorr, and K. P. Rodbell, J. Appl. Phys. 76, 2671 (1994).
2. K. P. Rodbell, V. Svilan, L. M. Gignac, P. W. DeHaven, R. J. Murphy, and T. J. Licata, Mater. Res. Soc. Symp. Proc. 403, 617 (1996).
3. H. Onoda, K. Touchi, and K. Hashimoto, Jpn. J. Appl. Phys., Part 2 34, L1037 (1995).
4. D. B. Knorr, D. P. Tracy, and K. P. Rodbell, Appl. Phys. Lett. 59, 3241 (1991).
5. M. J. C. van den Homberg, P. F. A. Alkemade, J. L. Hurd, G. J. Leusink, and S. Radelaar, Mater. Res. Soc. Symp. Proc. 391, 397 (1995).
6. M. J. C. van den Homberg, P. F. A. Alkemade, S. Radelaar, J. L. Hurd, and A. G. Dirks, Appl. Phys. Lett. 70, 318 (1997).
7. S. Vaidya and A. K. Sinha, Thin Solid Films 75, 253 (1981).
8. D. B. Knorr and K. P. Rodbell, J. Appl. Phys. 79, 2409 (1996).
9. L. M. Ting and Q-Z. Hong, Mater. Res. Soc. Symp. Proc. 428, 75 (1996).
10. T. Sasaki and H. Dohnomae, Jpn. J. Appl. Phys., Part 1 37, 6544 (1998).
11. J. L. Hurd, K. P. Rodbell, D. B. Knorr, and N. L. Koligman, Mater. Res. Soc. Symp. Proc. 343, 653 (1994).
12. J. M. E. Harper and K. P. Rodbell, J. Vac. Sci. Technol. B 15, (1997).
13. The National Technology Roadmap for Semiconductors (Semiconductor Industry Association, San Jose, CA, 1999).
14. J. A. Venables and C. J. Harland, Philos. Mag. 27, 1193 (1973).
15. J. Hjelen and E. Nes, in Proceedings of the XIIth International Congress for Electron Microscopy, Japan (San Francisco, San Francisco, CA, 1990).
16. D. P. Field, J. E. Sanchez, Jr., P. R. Besser, and D. J. Dingley, J. Appl. Phys. 82, 2383 (1997).
17. J. L. Hurd, K. P. Rodbell, L. M. Gignac, L. A. Clevenger, R. C. Iggulden, R. F. Schnabel, S. J. Weber, and N. H. Schmidt, Appl. Phys. Lett. 72, 326 (1998).
18. L. M. Gignac et al., Proceedings Advanced Metallization and Interconnect Systems Conference, 1997 (Materials Research Society, Pittsburgh, PA, 1998).
19. L. A. Clevenger et al., Proc. IEEE IITC 1998 Conference, Vol. 137.
20. R. Iggulden et al., Solid State Technol. 41, 37 (1998).
21. K. P. Rodbell, L. M. Gignac, R. Filippi, J. L. Hurd, Y. Y. Wang, L. A. Iggulden, R. F. Schnabel, and S. Weber, ICOTOM-12 Proceedings, Montreal, Canada, 9 August, 1999, pp. 1287-1292.
22. D. B. Knorr, S. M. Merchant, and M. A. Biberger, J. Vac. Sci. Technol. B 16, 2734 (1998).
23. W. W. Mullins, Acta Metall. 64, 414 (1958).
24. C. V. Thompson, Annu. Rev. Mater. Sci. 20, 245 (1990).
25. X. Chu, J. A. Prybyla, S. K. Theiss, and M. A. Marcus, Appl. Phys. Lett. 75, 3790 (1999).
26. J. Proost, A. Witvrouw, K. Maex, J. Dhaen, and P. Cosemans, J. Appl. Phys. 87, 89 (2000).
27. R. G. Filippi, E. N. Levine, and K. P. Rodbell, J. Vac. Sci. Technol. B 15, 750 (1997).
28. L. Vanasupa, Y-C. Joo, P. R. Besser, and S. Pramanick, J. Appl. Phys. 85, 2583 (1999).
29. M. Hosaka, T. Kouno, Y. Hayakowa, H. Nina, and M. Yamada, IEEE 98CH36173 36th Annual International Relia. Physics Symposium, p. 329.
30. T. Kuono, M. Hosaka, H. Niwa, and M. Yamada, J. Appl. Phys. 84, 742 (1998).