Electromigration characterization for multilevel metallizations using textured AlCu

Materials Research Society Symposium - Proceedings

Volumn 428, Issue , 1996, Pages 75-80

  Ting, Larry M ^a   Hong, Qi Zhong ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; CRYSTALLOGRAPHY; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; METALLIZING; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING FILMS; SURFACE STRUCTURE; TEXTURES;

ATOMIC DIFFUSIVITY; TEXTURE ENHANCEMENT;

ELECTROMIGRATION;

EID: 0030405356     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-428-75     Document Type: Conference Paper

References (16)