Electromigration behavior of hot-sputtered Al(Cu) versus chemical vapor deposition W vias

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 15, Issue 3, 1997, Pages 750-756

  Filippi, R G ^a   Levine, E N ^a   Rodbell, K P ^b  

^a IBM MICROELECTRONICS   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0009229449     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.589381     Document Type: Article

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