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Journal of Applied Physics

Volumn 84, Issue 2, 1998, Pages 742-750

Effect of Al3Ti intermetallic compound on electromigration lifetime of Al alloy interconnections

(4) Kouno, T a Hosaka, M a Niwa, H a Yamada, M a

a FUJITSU LABORATORIES LTD (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTROMIGRATION; GRAIN BOUNDARIES; INTERMETALLICS; MAGNETRON SPUTTERING; PHOTOLITHOGRAPHY; PLASMA ETCHING; SEMICONDUCTOR DEVICE STRUCTURES; TITANIUM; TRANSMISSION ELECTRON MICROSCOPY;

CROSS SECTIONAL SCANNING ION MICROSCOPES; MEAN TIME TO FAILURE; MULTI CHAMBER DE MAGNETRON SPUTTERING SYSTEM; PLASMA DRY ETCHING;

ALUMINUM ALLOYS;

EID: 0032527245 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.368132 Document Type: Article

Times cited : (17)

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