An Innovative Bonding Technique for Optical Chips Using Solder Bumps That Eliminate Chip Positioning Adjustments

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 15, Issue 2, 1992, Pages 225-230

  Hayashi, Tsuyoshi ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING--DISSIMILAR MATERIALS; INTEGRATED CIRCUIT MANUFACTURE--BONDING; OPTOELECTRONIC DEVICES--SOLDERING;

CHIP BONDING; OPTICAL CHIPS; SOLDER BUMPS; THERMAL CYCLING;

INTEGRATED OPTICS;

EID: 0026851220     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.142898     Document Type: Article

References (25)

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