Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits

IEEE Photonics Technology Letters

Volumn 11, Issue 1, 1999, Pages 128-130

  Krishnamoorthy, A V ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

CMOS integrated circuits; Flip chip devices; Laser arrays; Optical interconnections; Quantum well devices; Smart pixels; Vcsel's

Indexed keywords

CMOS INTEGRATED CIRCUITS; FLIP CHIP DEVICES; OPTICAL INTERCONNECTS; SEMICONDUCTOR QUANTUM WELLS; THRESHOLD VOLTAGE; VLSI CIRCUITS;

VERTICAL-CAVITY SURFACE-EMITTING LASERS (VCSEL);

INTEGRATED OPTOELECTRONICS;

EID: 0032735792     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/68.736418     Document Type: Article

References (4)

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2. A. Von Lehmen, T. C. Banwell, R. Cordell, C. Chang-Hasnain, J. W. Mann, J. Harbison, and L. Florez, "High speed operation of hybrid vertical-cavity surface-emitting laser array," Electron. Lett., vol. 27, pp. 1189-1191, 1991.
3. M. W. Maeda, C. Chang-Hasnain, A. Von Lehmen, H. Izadpanah, C. Lin, M. Z. Iqbal, L. Florez, and J. Harbison, "Multigigabit/s operation of 16-wavelength vertical-cavity surface-emitting laser array," IEEE Photon. Technol. Lett., vol. 3, pp. 863-865, 1991.
4. H.-J. J. Yeh and J. S. Smith, "Integration of GaAs vertical-cavity surface emitting laser on Si by substrate removal," Appl. Phys. Lett., vol. 64, pp. 1466-1468, Mar. 1994.