3-D packaging methodologies for microsystems

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 4, 2000, Pages 623-630

  Kelly, Gerard ^a,b   Morrissey, Anthony ^b   Alderman, John ^c   Camon, Henri ^c  

^a IEEE

^b UNIVERSITY COLLEGE CORK   (Ireland)

^c LAAS CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; STRESSES;

MICROSYSTEMS; PLASTIC LEADLESS CHIP CARRIERS; THERMOMECHANICAL STRESS;

ELECTRONICS PACKAGING;

EID: 0034314980     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.883751     Document Type: Article

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