-
1
-
-
0027553273
-
Analysis of the effects on scaling on interconnects delay in ULSI circuits
-
Mar.
-
S. Bothra, "Analysis of the effects on scaling on interconnects delay in ULSI circuits," IEEE Trans. Electron Devices, vol. 40, pp. 591-597, Mar. 1993.
-
(1993)
IEEE Trans. Electron Devices
, vol.40
, pp. 591-597
-
-
Bothra, S.1
-
2
-
-
0029333140
-
The evolution of interconnection technology at IBM
-
July
-
J. G. Ryan, R. M. Geffken, N. R. Poulin, and J. R. Paraszczak, "The evolution of interconnection technology at IBM," IBM J. Res. Develop., vol. 39, no. 4, pp. 371-382, July 1995.
-
(1995)
IBM J. Res. Develop.
, vol.39
, Issue.4
, pp. 371-382
-
-
Ryan, J.G.1
Geffken, R.M.2
Poulin, N.R.3
Paraszczak, J.R.4
-
3
-
-
0030381861
-
An efficient approach to simultaneous transistor and interconnect sizing
-
San Jose, CA, Nov.
-
J. Gong and L. He, "An efficient approach to simultaneous transistor and interconnect sizing," in Proc. IEEE Inf. Conf. Computer-Aided Design, San Jose, CA, Nov. 1996, pp. 181-186.
-
(1996)
Proc. IEEE Inf. Conf. Computer-Aided Design
, pp. 181-186
-
-
Gong, J.1
He, L.2
-
4
-
-
0031374726
-
Global interconnect sizing and spacing with consideration of coupling capacitance
-
San Jose, CA, Nov.
-
J. Cong, L. He, C. K. Koh, and Z. Pan, "Global interconnect sizing and spacing with consideration of coupling capacitance," in Proc. IEEE Int. Conf. Computer-Aided Design, San Jose, CA, Nov. 1997, pp. 628-633.
-
(1997)
Proc. IEEE Int. Conf. Computer-Aided Design
, pp. 628-633
-
-
Cong, J.1
He, L.2
Koh, C.K.3
Pan, Z.4
-
5
-
-
0031685846
-
An efficient technique for device and interconnect optimization in deep sub-micron designs
-
Apr.
-
J. Cong and L. He, "An efficient technique for device and interconnect optimization in deep sub-micron designs," in ACM Int. Symp. Physical Design, Apr. 1998, pp. 45-51.
-
(1998)
ACM Int. Symp. Physical Design
, pp. 45-51
-
-
Cong, J.1
He, L.2
-
6
-
-
85008023522
-
Modeling the wiring of deep-submicron ICs
-
Mar.
-
M. D. Walker, "Modeling the wiring of deep-submicron ICs," IEEE Spectr., vol. 37, no. 3, pp. 65-71, Mar. 2000.
-
(2000)
IEEE Spectr.
, vol.37
, Issue.3
, pp. 65-71
-
-
Walker, M.D.1
-
7
-
-
0033891230
-
Effects of inductance on the propagation delay and repeater insertion in VLSI circuits
-
Apr.
-
Y. I. Ismail and E. G. Friedman, "Effects of inductance on the propagation delay and repeater insertion in VLSI circuits," IEEE Trans. VLSI Syst., vol. 8, pp. 195-206, Apr. 2000.
-
(2000)
IEEE Trans. VLSI Syst.
, vol.8
, pp. 195-206
-
-
Ismail, Y.I.1
Friedman, E.G.2
-
9
-
-
84864895640
-
-
By courtesy of Schlumberger. [Online]. Available: http:/www.slb.com/ate
-
-
-
-
10
-
-
0027798939
-
High-speed VLSI interconnect modeling based on S-parameter measurements
-
Aug.
-
Y. Eo and W. R. Eisenstadt, "High-speed VLSI interconnect modeling based on S-parameter measurements," IEEE Trans. Comp. Hybrids Manuf. Technol., vol. 16. pp. 555-562, Aug. 1993.
-
(1993)
IEEE Trans. Comp. Hybrids Manuf. Technol.
, vol.16
, pp. 555-562
-
-
Eo, Y.1
Eisenstadt, W.R.2
-
11
-
-
0031620050
-
Accurate characteristic impedance measurement on silicon
-
Baltimore, MD, June 9-11, 1998 IEEE MTT-S Symp. Dig.
-
D. F. Williams, U. Arz, and H. Grabinski, "Accurate characteristic impedance measurement on silicon," in IEEE MTT-S, Int. Microwave Symp., Joint ARFTG and IMS Session TH4B, Baltimore, MD, June 9-11, 1998, 1998 IEEE MTT-S Symp. Dig., pp. 1917-1920.
-
(1998)
IEEE MTT-S, Int. Microwave Symp., Joint ARFTG and IMS Session TH4B
, pp. 1917-1920
-
-
Williams, D.F.1
Arz, U.2
Grabinski, H.3
-
12
-
-
0029771322
-
An accurate determination of the characteristic impedance of lossy lines on chips based on high frequency S-parameter measurements
-
Feb.
-
T. M. Winkel, L. S. Dutta, and H. Grabinski, "An accurate determination of the characteristic impedance of lossy lines on chips based on high frequency S-parameter measurements," in IEEE MultiChip Module Conf. MCMC'96, Feb. 1996, pp. 190-195.
-
(1996)
IEEE MultiChip Module Conf. MCMC'96
, pp. 190-195
-
-
Winkel, T.M.1
Dutta, L.S.2
Grabinski, H.3
-
13
-
-
0027640650
-
Accurate transmission line characterization
-
Aug.
-
D. F. Williams and R. B. Marks, "Accurate transmission line characterization," IEEE Microwave Guided Wave Lett., vol. 3, pp. 247-249, Aug. 1993.
-
(1993)
IEEE Microwave Guided Wave Lett.
, vol.3
, pp. 247-249
-
-
Williams, D.F.1
Marks, R.B.2
-
15
-
-
0032075075
-
An on-chip interconnect capacitance characterization method with sub-femto farad resolution
-
May
-
J. C. Chen, D. Sylvester, and C. Hu, "An on-chip interconnect capacitance characterization method with sub-femto farad resolution," IEEE Trans. Semiconduct. Manufacl., pp. 204-210, May 1998.
-
(1998)
IEEE Trans. Semiconduct. Manufacl.
, pp. 204-210
-
-
Chen, J.C.1
Sylvester, D.2
Hu, C.3
-
16
-
-
0031139438
-
Use of test structures for characterization and modeling of inter- And infra-layer capacitances in a CMOS process
-
May
-
P. Nouet and A. Toulouse, "Use of test structures for characterization and modeling of inter- and infra-layer capacitances in a CMOS process," IEEE Trans. Semicunduct. Manufuct., vol. 10, pp. 233-241, May 1997.
-
(1997)
IEEE Trans. Semicunduct. Manufuct.
, vol.10
, pp. 233-241
-
-
Nouet, P.1
Toulouse, A.2
-
17
-
-
3242845671
-
Measurement of crosstalk induced delay errors in integrated circuits
-
Sept.
-
F. Moll, M. Roca, and A. Rubio, "Measurement of crosstalk induced delay errors in integrated circuits," Electron. Lett., vol. 33, Sept. 1997.
-
(1997)
Electron. Lett.
, vol.33
-
-
Moll, F.1
Roca, M.2
Rubio, A.3
-
18
-
-
33646929501
-
A novel technique for the dynamic measurements of crosstalk induced delay in CMOS integrated circuits
-
Nov.
-
S. Delrnas, E. Sicard, and F. Caignet, "A novel technique for the dynamic measurements of crosstalk induced delay in CMOS integrated circuits,"' IEEE Trans. Eleclromagn. Compa!., vol. 41, pp. 403-406, Nov. 1999.
-
(1999)
IEEE Trans. Eleclromagn. Compa!.
, vol.41
, pp. 403-406
-
-
Delrnas, S.1
Sicard, E.2
Caignet, F.3
-
19
-
-
0032635504
-
Accurate on-chip interconnect evaluation: A time-domain technique
-
May
-
[19J K. Soumyanath et al., "Accurate on-chip interconnect evaluation: a time-domain technique," IEEE J. Solid-State Circuits, vol. 34, pp. 623-631, May 1999.
-
(1999)
IEEE J. Solid-State Circuits
, vol.34
, pp. 623-631
-
-
Soumyanath, J.K.1
-
20
-
-
84864895008
-
-
MEDEA. Micro-electronics development for European applications. [Online]. Available: http://www.niedea.org
-
-
-
-
21
-
-
34748823693
-
The transient response of damped linear networks
-
Jan.
-
W. C. Eimore, "The transient response of damped linear networks," J. Appl. Phys., vol. 19, pp. 55-63, Jan. 1948.
-
(1948)
J. Appl. Phys.
, vol.19
, pp. 55-63
-
-
Eimore, W.C.1
-
22
-
-
33646926730
-
Accurate modeling of interconnects for timing simulation of sub-micron circuits
-
H. Grabinski, Ed. Boston, VIA: Kluwer.
-
D. Deschacht and E. Vanier, "Accurate modeling of interconnects for timing simulation of sub-micron circuits," in Signal Propagation on interconnects, H. Grabinski, Ed. Boston, VIA: Kluwer.
-
Signal Propagation on Interconnects
-
-
Deschacht, D.1
Vanier, E.2
-
23
-
-
33747574386
-
Analytical modeling and characterization of deep-submicrometer interconnect
-
Apr.
-
D. Sylvester, "Analytical modeling and characterization of deep-submicrometer interconnect," Proc. IEEE, vol. 89, pp. 467-489, Apr. 2001.
-
(2001)
Proc. IEEE
, vol.89
, pp. 467-489
-
-
Sylvester, D.1
-
24
-
-
0031168374
-
Analytical model for switching transitions of subrnicron CMOS logic
-
June
-
H. J. Park and M. Soina, "Analytical model for switching transitions of subrnicron CMOS logic," IEEE J. Solid-State Circuits, vol. 32, pp. 880-889, June 1997.
-
(1997)
IEEE J. Solid-State Circuits
, vol.32
, pp. 880-889
-
-
Park, H.J.1
Soina, M.2
-
25
-
-
0030213826
-
Delay propagation effect in transistor gates
-
Aug.
-
D. Deschacht, C. Dabrin. and D. Auvergne, "Delay propagation effect in transistor gates," IEEE J. Solid-State Circuits, vol. 31, pp. 1184-1187, Aug. 1996.
-
(1996)
IEEE J. Solid-State Circuits
, vol.31
, pp. 1184-1187
-
-
Deschacht, D.1
Dabrin, C.2
Auvergne, D.3
-
26
-
-
0032755192
-
Modeling crosstalk in resistive VLSI interconnections
-
Jan.
-
A. Vittal and L. H. Chen et al., "Modeling crosstalk in resistive VLSI interconnections," in 12th Int. Conf. VLSI Design, Jan. 1999.
-
(1999)
12th Int. Conf. VLSI Design
-
-
Vittal, A.1
Chen, L.H.2
-
27
-
-
0029516536
-
Optimal wire sizing and buffer insertion for low power and generalized delay model
-
Nov.
-
J. Lulls, C. K. Cheng, and T. T. Y. Lin, "Optimal wire sizing and buffer insertion for low power and generalized delay model," in Proc. Int. Conf. Computer-Aided Design, Nov. 1996, pp. 138-143.
-
(1996)
Proc. Int. Conf. Computer-Aided Design
, pp. 138-143
-
-
Lulls, J.1
Cheng, C.K.2
Lin, T.T.3
-
28
-
-
0030417361
-
Moment model of general transmission tines with application to interconnect analysis and optimization
-
Dec.
-
Q. Yu, E. S. Kuh, and T. Xue, "Moment model of general transmission tines with application to interconnect analysis and optimization," IEEE Trans. VLSI Syst., vol. 4, pp. 477-494, Dec. 1996.
-
(1996)
IEEE Trans. VLSI Syst.
, vol.4
, pp. 477-494
-
-
Yu, Q.1
Kuh, E.S.2
Xue, T.3
-
29
-
-
0022061669
-
Optimal interconnection circuits for VLSI."
-
May
-
H. B. Bakoglu and J. D. Meindi, "Optimal interconnection circuits for VLSI." IEEE Trans. Electron Devices, vol. ED-32, pp. 903-909, May 1985.
-
(1985)
IEEE Trans. Electron Devices
, vol.ED-32
, pp. 903-909
-
-
Bakoglu, H.B.1
Meindi, J.D.2
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