SCOPUS 정보 검색 플랫폼

Microelectronic Engineering

Volumn 77, Issue 1, 2005, Pages 76-84

A dishing model for chemical mechanical polishing of metal interconnect structures

(1) Chang, Shih Hsiang a

a FAR EAST UNIVERSITY (Taiwan)

Author keywords

Chemical mechanical polishing; Contact mechanics; Dishing

Indexed keywords

CHEMICAL ANALYSIS; DIELECTRIC MATERIALS; ELECTRIC RESISTANCE; OPTIMIZATION; SILICON WAFERS; ULSI CIRCUITS;

CONTACT MECHANICS; DISHING; GLOBAL PLANARIZATION; METAL INTERCONNECT STRUCTURES;

CHEMICAL MECHANICAL POLISHING;

EID: 9644294395 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2004.09.003 Document Type: Article

Times cited : (24)

References (28)

1
- 0026943966
- H. Landis, P. Burke, W. Cote, W. Hill, C. Hoffmann, C. Kaanta, C. Koburger, W. Lange, M. Leach, S. Luce, Thin Solid Film 220 (1992) 1-7.
- (1992) Thin Solid Film , vol.220 , pp. 1-7
- Landis, H.¹ Burke, P.² Cote, W.³ Hill, W.⁴ Hoffmann, C.⁵ Kaanta, C.⁶ Koburger, C.⁷ Lange, W.⁸ Leach, M.⁹ Luce, S.¹⁰

2
- 0028516105
- J.M. Steigerwald, R. Zirpoli, S.P. Murarka, D. Price, R.J. Gutmann, J. Electrochem. Soc. 141 (10) (1994) 2842-2848.
- (1994) J. Electrochem. Soc. , vol.141 , Issue.10 , pp. 2842-2848
- Steigerwald, J.M.¹ Zirpoli, R.² Murarka, S.P.³ Price, D.⁴ Gutmann, R.J.⁵

3
- 0003961880
- M. Rutten, P. Feeney, R. Cheek, W. Landers, Semicond. Int. 9 (1996) 123-128.
- (1996) Semicond. Int. , vol.9 , pp. 123-128
- Rutten, M.¹ Feeney, P.² Cheek, R.³ Landers, W.⁴

4
- 0041163674
- H. van Kranenburg, H.D. van Corbach, P.H. Woerlee, M. Lohmeier, Microelectron. Eng. 33 (1997) 241-248.
- (1997) Microelectron. Eng. , vol.33 , pp. 241-248
- Van Kranenburg, H.¹ Van Corbach, H.D.² Woerlee, P.H.³ Lohmeier, M.⁴

5
- 0000467901
- Z. Stavreva, D. Zeidler, M. Plotner, G. Grasshoff, K. Drescher, Microelectron. Eng. 33 (1997) 249-257.
- (1997) Microelectron. Eng. , vol.33 , pp. 249-257
- Stavreva, Z.¹ Zeidler, D.² Plotner, M.³ Grasshoff, G.⁴ Drescher, K.⁵

6
- 17344376178
- M. Fayolle, F. Romagna, Microelectron. Eng. 37/38 (1997) 135-141.
- (1997) Microelectron. Eng. , vol.37-38 , pp. 135-141
- Fayolle, M.¹ Romagna, F.²

7
- 0031270478
- Z. Stavreva, D. Zeidler, M. Plotner, K. Drescher, Microelectron. Eng. 37/38 (1997) 143-149.
- (1997) Microelectron. Eng. , vol.37-38 , pp. 143-149
- Stavreva, Z.¹ Zeidler, D.² Plotner, M.³ Drescher, K.⁴

8
- 0032050873
- H. van Kranenburg, P.H. Woerlee, J. Electrochem. Soc. 145 (4) (1998) 1285-1291.
- (1998) J. Electrochem. Soc. , vol.145 , Issue.4 , pp. 1285-1291
- Van Kranenburg, H.¹ Woerlee, P.H.²

9
- 9644286733
- T. Park, T. Tugbawa, J. Yoon, D. Boning, J. Chung, R. Muralidhar, S. Hymes, Y. Gotkis, S. Alamgir, R. Walesa, L. Shumway, G. Wu, F. Zhang, R. Kister, J. Hawkins, in: Proceedings of the VLSI Multilevel Interconnect Conference, 1998, pp. 437-442.
- (1998) Proceedings of the VLSI Multilevel Interconnect Conference , pp. 437-442
- Park, T.¹ Tugbawa, T.² Yoon, J.³ Boning, D.⁴ Chung, J.⁵ Muralidhar, R.⁶ Hymes, S.⁷ Gotkis, Y.⁸ Alamgir, S.⁹ Walesa, R.¹⁰ Shumway, L.¹¹ Wu, G.¹² Zhang, F.¹³ Kister, R.¹⁴ Hawkins, J.¹⁵

10
- 0002978729
- J.T. Pan, P. Li, W. Kapila, S. Tsai, F. Redeker, T. Park, T. Tugbawa, D. Boning, in: Proceedings of the 4th Interna tional Conference of Chemical-Mechanical Polishing for ULSI Multilevel Interconnection, 1999, pp. 423-429.
- (1999) Proceedings of the 4th Interna Tional Conference of Chemical-mechanical Polishing for ULSI Multilevel Interconnection , pp. 423-429
- Pan, J.T.¹ Li, P.² Kapila, W.³ Tsai, S.⁴ Redeker, F.⁵ Park, T.⁶ Tugbawa, T.⁷ Boning, D.⁸

11
- 65649137609
- Chemical Mechanical Polishing IC Device Manufacturing III
- T. Park, T. Tugbawa, D. Boning, S. Hymes, T. Brown, K. Smekalin, G. Schwartz, in: Chemical Mechanical Polishing IC Device Manufacturing III, Electrochemical Society Proceedings, vol. 99-37, 1999, pp. 94-100.
- (1999) Electrochemical Society Proceedings , vol.99 , Issue.37 , pp. 94-100
- Park, T.¹ Tugbawa, T.² Boning, D.³ Hymes, S.⁴ Brown, T.⁵ Smekalin, K.⁶ Schwartz, G.⁷

12
- 0001926030
- T. Park, T. Tugbawa, D. Boning, in: Proceedings of the 5th International Conference of Chemical-Mechanical Polishing for ULSI Multilevel Interconnection, 2000, pp. 196-205.
- (2000) Proceedings of the 5th International Conference of Chemical-mechanical Polishing for ULSI Multilevel Interconnection , pp. 196-205
- Park, T.¹ Tugbawa, T.² Boning, D.³

13
- 0032071103
- N. Elbel, B. Neureither, B. Ebersberger, P. Lahnor, J. Electrochem. Soc. 145 (5) (1998) 1659-1664.
- (1998) J. Electrochem. Soc. , vol.145 , Issue.5 , pp. 1659-1664
- Elbel, N.¹ Neureither, B.² Ebersberger, B.³ Lahnor, P.⁴

14
- 0036226177
- J.Y. Lai, N. Saka, J.H. Chun, J. Electrochem. Soc. 149 (1) (2002) G41-G50.
- (2002) J. Electrochem. Soc. , vol.149 , Issue.1
- Lai, J.Y.¹ Saka, N.² Chun, J.H.³

15
- 1042269664
- R. Saxena, D.G. Thakurta, R.J. Gutmann, W.N. Gill, Thin Solid Film 449 (2004) 192-206.
- (2004) Thin Solid Film , vol.449 , pp. 192-206
- Saxena, R.¹ Thakurta, D.G.² Gutmann, R.J.³ Gill, W.N.⁴

16
- 1442285896
- J.J. Vlassak, J. Mech. Phys. Solids 52 (2004) 847-873.
- (2004) J. Mech. Phys. Solids , vol.52 , pp. 847-873
- Vlassak, J.J.¹

17
- 0032194467
- J.A. Levert, F.M. Mess, R.F. Salant, S. Danyluk, A.R. Baker, STLE Tribol. Trans. 41 (4) (1998) 593-599.
- (1998) STLE Tribol. Trans. , vol.41 , Issue.4 , pp. 593-599
- Levert, J.A.¹ Mess, F.M.² Salant, R.F.³ Danyluk, S.⁴ Baker, A.R.⁵

18
- 0034174259
- J.A. Levert, S. Danyluk, J. Tichy, ASME J. Tribol. 122 (2000) 450-457.
- (2000) ASME J. Tribol. , vol.122 , pp. 450-457
- Levert, J.A.¹ Danyluk, S.² Tichy, J.³

19
- 0034480717
- L. Shan, J. Levert, L. Meade, J. Tichy, S. Danyluk, ASME J. Tribol. 122 (2000) 539-543.
- (2000) ASME J. Tribol. , vol.122 , pp. 539-543
- Shan, L.¹ Levert, J.² Meade, L.³ Tichy, J.⁴ Danyluk, S.⁵

20
- 0032099606
- O.G. Chekina, L.M. Keer, H. Liang, J. Electrochem. Soc. 145 (6) (1998) 2100-2106.
- (1998) J. Electrochem. Soc. , vol.145 , Issue.6 , pp. 2100-2106
- Chekina, O.G.¹ Keer, L.M.² Liang, H.³

21
- 85040875608
- Cambridge University Press, Cambridge, UK
- K.L. Johnson, Contact Mechanics, Cambridge University Press, Cambridge, UK, 1985.
- (1985) Contact Mechanics
- Johnson, K.L.¹

22
- 0001611894
- F. Preston, J. Soc. Glass. Technol. 11 (1927) 214-256.
- (1927) J. Soc. Glass. Technol. , vol.11 , pp. 214-256
- Preston, F.¹

23
- 0026170357
- W.P. Patrick, W.L. Guthrie, C.L. Standley, P.M. Schiable, J. Electrochem. Soc. 138 (6) (1991) 1778-1783.
- (1991) J. Electrochem. Soc. , vol.138 , Issue.6 , pp. 1778-1783
- Patrick, W.P.¹ Guthrie, W.L.² Standley, C.L.³ Schiable, P.M.⁴

24
- 36149025564
- E. Buckingham, Phys. Rev. 4 (1914) 345-376.
- (1914) Phys. Rev. , vol.4 , pp. 345-376
- Buckingham, E.¹

25
- 0033737240
- Chemical-Mechanical Polishing - Fundamentals and Challenges
- S. Hymes, K. Smekalin, T. Brown, H. Yeung, M. Joffe, M. Banet, T. Park, T. Tugbawa, D. Boning, J. Nguyen, T. West, W. Sands, in: Chemical-Mechanical Polishing - Fundamentals and Challenges, Materials Research Society Symposium Proceedings, vol. 566, 1999, pp. 211-216.
- (1999) Materials Research Society Symposium Proceedings , vol.566 , pp. 211-216
- Hymes, S.¹ Smekalin, K.² Brown, T.³ Yeung, H.⁴ Joffe, M.⁵ Banet, M.⁶ Park, T.⁷ Tugbawa, T.⁸ Boning, D.⁹ Nguyen, J.¹⁰ West, T.¹¹ Sands, W.¹²

26
- 0013004933
- T. Gan, T. Tugbawa, B. Lee, D. Boning, S. Jang, J. Electrochem. Soc. 148 (3) (2001) G159-G165.
- (2001) J. Electrochem. Soc. , vol.148 , Issue.3
- Gan, T.¹ Tugbawa, T.² Lee, B.³ Boning, D.⁴ Jang, S.⁵

27
- 0242612546
- Chemical Mechanical Planarization I
- A.R. Baker, in: Chemical Mechanical Planarization I, Electrochemical Society Proceedings, vol. 96-22, 1996, pp. 228-238.
- (1996) Electrochemical Society Proceedings , vol.96 , Issue.22 , pp. 228-238
- Baker, A.R.¹

28
- 0033639551
- V. Nguyen, H. Van Kranenburg, P. Woerlee, Microelectron. Eng. 50 (2000) 403-410.
- (2000) Microelectron. Eng. , vol.50 , pp. 403-410
- Nguyen, V.¹ Van Kranenburg, H.² Woerlee, P.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.