Research of underfill delamination in flip chip by the J-integral method

Journal of Electronic Packaging

Volumn 126, Issue 1, 2004, Pages 94-99

  Xu, Bulu ^a   Cai, Xia ^a   Huang, Weidong ^a   Cheng, Zhaonian ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

Crack propagation; Finite element simulation; Flip chip; Interfacial delamination; J integral

Indexed keywords

COMPUTER SIMULATION; CRACKS; CYCLIC LOADS; DELAMINATION; ENGINEERING RESEARCH; FINITE ELEMENT METHOD; FRACTURE MECHANICS; INTEGRAL EQUATIONS; RELIABILITY; THERMAL CYCLING;

INTERFACIAL DELAMINATION; STRAIN ENERGY; THERMAL CYCLING CHAMBERS; THERMAL MISMATCH;

FLIP CHIP DEVICES;

EID: 8744298192     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1648061     Document Type: Article

References (19)

1. Subir, E., 1998, "The Future of Microelectronic and Photonics and the Role of Mechanics and Materials," ASME J. Electron. Packag., 120, pp. 1-11.
2. Suryanarayana, D., Hsiao, R., Gall, T. P., and McCreary, I. M., 1991, "Enhancement of Flip Chip Fatigue Life by Encapsulation," IEEE Trans. Compon., Hybrids, Manuf. Technol., 14, pp. 218-223.
3. Lau, J. H., 1996, "Solder Joints Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical and Vibrational Conditions," IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 19, pp. 728-735.
4. Gektin, V., Bar-Cohen, A., and Ames, J., 1997, "Coffin-Manson Fatigue Model of Underfilled Flip-Chip," IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20, Sept., pp. 317-325.
5. Nakano, F. et al., 1987, "Resin Insertion Effect on Thermal Cycle Resistively of Flip Chip Mounted LSI Devise," Proceedings 1987 ISHM Conference, pp. 536-541.
6. Tsukada, Y., 1994, "Solder Bumped Flip Chip Attach on SLC Board and Multi-Chip Module," Chips on Board Technologies for Multi-chip Modules, J. H. Lan, ed., New York, Van Nostrand Reinhold, pp. 410-443.
7. Gurumurthy, C. K., Jiao, J., Norris, L. G., Hui, C. Y., and Kramer, E. J., 1998, "A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces," ASME J. Electron. Packag., 120, pp. 372-378.
8. Kook, S.-Y., Snodgrass, J. M., Kirtikar, A., and Dauskardt, R. H., 1998, "Adhesion and Reliability of Polymer/Inorganic Interfaces," ASME J. Electron. Packag., 120, pp. 328-335.
9. Wang, Jianjun, Lu, Minfu, Zou, Daqing, and Liu, Sheng, 1998, "Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load," IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 21(1), pp. 79-85.
10. Wang, Jianjun, Zou, Daqing, Lu, Minfu, Ren, Wen, and Liu, Sheng, 1999, "Evaluation of Interfacial Fracture Toughness of a Flip-Chip Package and a Bimaterial System by a Combined Experimental and Numerical Method," Eng. Fract. Mech., 64, pp. 781-795.
11. Yao, Qizhou, Qu, Jianmin, Wu, Jiali, and Wong, C. P., 1999, IEEE Trans. Electronic Packaging Manufact., 22(4), pp. 264-267.
12. Lau, John H., Ricky, S.-W., Ricky, S.-W., and Chang, Chis, 2000, "Effects of Underfill Material Properties on the Reliability of Solder Bumped Flip Chip on Board With Imperfect Underfill Encapsulants," IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 23(2), pp. 323-332.
13. Zhang, Q., Xie, X. M., Chen, L., Wang, G. Z., Cheng, Z. N., and Kempe, W., 2000, "On the Degradation of the Solder Joints of Underfilled Flip Chip Packages: A Case Study," Soldering & Surface Mount Technology, 12(3), pp. 24-28.
14. Chen, L., Zhang, Q., Wang, G. Z., Xie, X. M., and Cheng, Z. N., 2001, "The Effects of Underfill and Its Material Models on Thermomechanical Behaviors of Flip Chip Package," IEEE Trans., 24(1), pp. 17-24.
15. Cheng, Z. N., Wang, G. Z., Chen, L., Wilde, J., and Becker, K., 2000, "Viscoplastic Anand Model for Tin-Lead Based Solders and Its Application," Soldering & Surface Mount Technology, J. of SMART, 12(2), pp. 31-36.
16. Wilde, J., Cheng, Z. N., and Wang, G. Z., 1999, "Influences of Packaging Materials on Solder Joint Reliability of Chip Scale Package Assemblies," Proc. 1999 Int. Symp. Adv. Packag. Mater., Braselton, GA, Mar. 14-17, pp. 144-149.
17. Rice, J. R., and Sih, G. C., 1965, "A Path Independent Integral and the Approximate Analysis of Strain Concentration by Notches and Cracks," ASME J. Appl. Mech., 35, pp. 379-386.
18. Weichen, Shi, and Bangkuang, Zhen, 1999, "J-Integal of Dissimilar Anisotropic Media," Int. J. Fract., 96, pp. 37-42.
19. Suo, Z., 1990, "Singularities, Interfaces and Cracks in Dissimilar Anisotropic Media," Proc. R. Soc. London, Ser. A, 427, pp. 331-358.