Characterization of underfill/substrate interfacial toughness enhancement by silane additives

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 4, 1999, Pages 249-

  Yao, Qizhou ^a,b   Qu, Jianmin ^a,b   Wu, Jiali ^a,c   Wong, C P ^a,c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33748033709     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)