3D system-in-package design using stacked silicon submount technology

Microelectronics International

Volumn 32, Issue 2, 2015, Pages 63-72

  Dong, Mingzhi ^a,b   Santagata, Fabio ^c,d   Sokolovskij, Robert ^a,b   Wei, Jia ^a,b   Yuan, Cadmus ^b,e   Zhang, Guoqi ^f  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b State Key Laboratory of Solid State Lighting   (China)

^c PEKING UNIVERSITY   (China)

^d Dongguan Quality Supervision Testing Center   (China)

^e INSTITUTE OF SEMICONDUCTORS   (China)

^f DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

LED; MEMS; Silicon submount; System in package

Indexed keywords

COST EFFECTIVENESS; INTERNET PROTOCOLS; LIGHT EMITTING DIODES; LIGHTING; MEMS; PHOSPHORUS COMPOUNDS; SILICON COMPOUNDS; SILICON WAFERS; THREE DIMENSIONAL INTEGRATED CIRCUITS; WAFER BONDING;

3D HETEROGENEOUS INTEGRATION; ASSEMBLY PROCESS; COST-EFFECTIVE SOLUTIONS; DESIGN/METHODOLOGY/APPROACH; MICRO ELECTROMECHANICAL SYSTEM (MEMS); SILICON EFFICIENCY; SILICON SUBMOUNTS; SUB MOUNTS;

SYSTEM-IN-PACKAGE;

EID: 84929104360     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/MI-11-2014-0050     Document Type: Article

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