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Volumn , Issue , 2011, Pages 1622-1625
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Silicon-based wafer-level packaging for cost reduction of high brightness LEDs
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Author keywords
[No Author keywords available]
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Indexed keywords
ACTIVE REGIONS;
DEVICE PERFORMANCE;
DIRECT INTEGRATION;
DRIVER IC;
HEAT CONDUCTANCE;
HIGH BRIGHTNESS LEDS;
HIGH THERMAL;
HIGH YIELD;
IC INDUSTRY;
LIGHTING APPLICATIONS;
METAL BONDING;
OVERALL EFFICIENCY;
PACKAGING COSTS;
POTENTIAL SOLUTIONS;
PROCESSING TECHNOLOGIES;
REDUCING COSTS;
SILICON-BASED;
SMALL FORM FACTORS;
THROUGH SILICON VIAS;
WAFER LEVEL;
WAFER LEVEL PACKAGING;
APPROXIMATION THEORY;
CHIP SCALE PACKAGES;
COST REDUCTION;
DIES;
LIGHT EMITTING DIODES;
LIGHT SOURCES;
LUMINANCE;
PACKAGING;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON WAFERS;
WAFER BONDING;
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EID: 79960384145
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2011.5898728 Document Type: Conference Paper |
Times cited : (17)
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References (12)
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