Life margin assessment with Physics of Failure Tools application to BGA packages

Microelectronics Reliability

Volumn 46, Issue 5-6, 2006, Pages 1013-1018

  Foucher, B ^a   Tomas, J ^a   Mounsi, F ^a   Jeremias, M ^a  

^a AIRBUS GROUP INNOVATIONS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATION THEORY; DATABASE SYSTEMS; ENVIRONMENTAL IMPACT; FAILURE ANALYSIS; PRODUCT DESIGN; RELIABILITY;

BALL GRID ARRAY (BGA); CYCLES TO FAILURE (CTF); MEAN TIME BETWEEN FAILURE (MTBF); PHYSICS OF FAILURE (POF);

ARRAYS;

EID: 33645162512     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.08.005     Document Type: Conference Paper

References (8)

1. Osterman M, Dasgupta A, Tonnelier L. In: Simulation improved testing of electronic hardware, 2002 Proceedings of the 48th ATM. ISBN: 1-877862-81-9, Document No. 2011, April 1, 2002.
2. Cunningham J, Valentin R, Hillman C, Dasgupta A, Osterman M. A demonstration of virtual qualification for the design of electronic hardware. In: ESTECH 2001, IEST, Phoenix, AZ, April 2001.
3. Mawer AJ, Hodges Popps DE, Koschmieder TH. Comparison of bump and substrate technologies for flip chip BGA. In: Proceedings of the international SMTA conference. Chicago, 26-28 September 2004 (CD-ROM).
4. Hong B, et al. Modelling thermally induced viscoplastic deformation and low cycle fatigue of CBGA solder joints in a surface mount package. In: IEEE proceedings of the intersociety conference on thermal phenomena, 1996. p. 158-65.
5. Pendse R, Afshari B, Butel N, Leibovitz J, Hosoi Y, Shimada M, et al. New CBGA package with improved 2nd level reliability. In: Proceedings of the 2000 electronic components and technology conference. 50th, San Diego, 21-24 May 2000. p. 1189-97.
6. R. Sigliano Bridging the gap between ceramics and organic packaging Adv Microelectron 29 5 2002 12 14
7. Engelmaier W. BGA and CGA solder attachments: results of low-acceleration reliability test and analysis. In: Proceedings NEPCON West '96. Anaheim, CA, February 1996. p. 1020-36.
8. Foucher B, Tonnelier L, Lemarchand C, Massiot G. Application of reliability tools-assessment of reliability of assemblies with calcePWA. In: Proceedings of the WEAG CEPA2 reliability workshop- microelectronics reliability strategies, MoD DPA, Abbey Wood, Bristol, UK, 1,2 October 2002. p. 79-82.