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Volumn 1, Issue , 2002, Pages 948-953

Virtual life assessment of electronic hardware used in the Advanced Amphibious Assault Vehicle (AAAV)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FAILURE ANALYSIS; LIFE CYCLE; RELIABILITY; VIRTUAL REALITY;

EID: 0036923936     PISSN: 02750708     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (12)

References (11)
  • 1
    • 0031650797 scopus 로고    scopus 로고
    • A fundamental overview of analytical accelerated testing models
    • Caruso, H., and A. Dasgupta. 1998. A fundamental overview of analytical accelerated testing models. Journal of IES 41 (1): 16-30.
    • (1998) Journal of IES , vol.41 , Issue.1 , pp. 16-30
    • Caruso, H.1    Dasgupta, A.2
  • 3
    • 0026374740 scopus 로고
    • Material failure mechanisms and damage models. - A tutorial series containing 14 articles
    • Dasgupta, A., and M. Pecht. 1991. Material failure mechanisms and damage models. - A tutorial series containing 14 articles IEEE Transactions on Reliability Lead Article appeared 40 (5): 531-536.
    • (1991) IEEE Transactions on Reliability Lead Article Appeared , vol.40 , Issue.5 , pp. 531-536
    • Dasgupta, A.1    Pecht, M.2
  • 5
    • 0027540946 scopus 로고
    • Generic reliability figures of merit design tool for surface mount solder attachments
    • Englemaier, W. 1993. Generic reliability figures of merit design tool for surface mount solder attachments. IEEE Transactions CHMT 16 (1): 103-112.
    • (1993) IEEE Transactions CHMT , vol.16 , Issue.1 , pp. 103-112
    • Englemaier, W.1
  • 9
    • 0004302552 scopus 로고    scopus 로고
    • Motorola Semiconductor Technical Data Document No. AN1231/D
    • Mawer, A. 1996. Plastic Ball Grid Array (PBGA). Motorola Semiconductor Technical Data Document No. AN1231/D.
    • (1996) Plastic Ball Grid Array (PBGA)
    • Mawer, A.1
  • 10
    • 0032647217 scopus 로고    scopus 로고
    • Failure-assessment software for circuit-card assemblies
    • Washington D.C.: Institute of Electrical and Electronics Engineers
    • Osterman, M., and T. Stadterman. 1999. Failure-assessment software for circuit-card assemblies. In Proceedings for the Annual Reliability and Maintainability Symposium, 269-276. Washington D.C.: Institute of Electrical and Electronics Engineers.
    • (1999) Proceedings for the Annual Reliability and Maintainability Symposium , pp. 269-276
    • Osterman, M.1    Stadterman, T.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.