Fatigue life assessment of bump type solder joint under vibration environment

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 699-704

  Lee, S B ^a   Ham, S J ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347663574     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)

1. Brakke, K. A., 1994, Surface Evolver Manual, Geometry Center, University of Minesota at Minneapolis St. Paul.
2. Corbin, J. S., 1993, "Finite Element Analysis for Solder Ball Connect(SBC) Structural Design Optimization," IBM J. Res. Develop., 37(5), p585-596.
3. nd ed., McGraw-Hill, New York.
4. Engel, P. A. and Miller, T. M., 1993, "Torsional Stiffness and Fatigue Study of Surface-Mounted Compliant Leaded System," IEEE Trans. CHMT, 16(6), pp. 577-583.
5. Ham, S. J. and Lee, S. B., 1996, "Experimental Study for Reliability of Electronic Packaging under Vibration," Experimental Mechanics, 36(4), pp. 339-344.
6. Jung, W., Lau, J. H., Pao, Y. H., 1997, "Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints," ASME J. Electronic Packaging, 119, p163-170.
7. Lau, J and Erasmus, S, 1993, "Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints under Bending, Twisting, and Thermal Conditions," ASME J. Electronic Packaging, 115, pp. 322-328.
8. Ling, S. and Dasqupta, A., 1997, "Thermomechanical Stress Analysis of BGA Interconnects using the MDRR Technique," EEP-Vol. 19-1, Advances in Electronic Packaging, p1109-1114.