IMA aircraft improvements

IEEE Aerospace and Electronic Systems Magazine

Volumn 20, Issue 9, 2005, Pages 11-17

  Wilkinson, Chris ^a,b  

^a UNIVERSITY OF MARYLAND   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMMERCIAL-OFF-THE-SHELF (COTS) TECHNOLOGY; INTEGRATED MODULAR AVIONICS (IMA);

AIRCRAFT; COMPUTER SOFTWARE; COST EFFECTIVENESS; HARDWARE;

AVIONICS;

EID: 27744474634     PISSN: 08858985     EISSN: None     Source Type: Journal    
DOI: 10.1109/MAES.2005.1514769     Document Type: Article

References (10)

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2. Shawlee, W. and Humphrey, D., Aging avionics - what causes it and how to respond, IEEE Transactions on Components and Packaging Technologies, Vol. 244, pp. 739-740, December 2001.
3. Shawlee, W., How Parts and Systems Age, Avionics Magazine, November 2000.
4. Huber, S., Segmentation and Reliability, DMSMS Conference, New Orleans, LA, March 2002.
5. Society of Automotive Engineers, Guidelines and Methods for Conducting the Safety Assessment Process on Civil Airborne Systems and Equipment, ARP 4761, November 1996.
6. Spitzer, C.R., The Avionics Handbook, ed. R.C. Dorf, 2001. The Electrical Engineering Handbook Series, CRC Press, Boca Raton, London, New York.
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8. Valentin, R., Cunningham, J., Osterman, M., Dasgupta, A., Pecht, M.G. and Tsagos, D., Virtual life assessment of electronic hardware used in the Advanced Amphibious Assault Vehicle (AAAV), Proceedings of the Winter Simulation Conference, pp. 948-953, Vol.1, 2002.
9. Mishra, S., Pecht, M., Smith, T., McNee, I. and Harris, R., Remaining Life Prediction of Electronic Products Using Life Consumption Monitoring Approach, European Microelectronics Packaging and Interconnection Symposium, Cracow, Poland, June 2002.
10. Ramakrishnan, A. and Pecht, M.G., A life consumption monitoring methodology for electronic systems, Components and Packaging Technologies, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, IEEE Transactions on), Vol. 26, No. 3, pp. 625-634, 2003. 1521-3331.