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Volumn , Issue , 2007, Pages

Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; MATHEMATICAL MODELS; POWER ELECTRONICS; STRAIN MEASUREMENT; STRENGTH OF MATERIALS;

EID: 36349002345     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2007.360017     Document Type: Conference Paper
Times cited : (9)

References (12)
  • 1
    • 0041885409 scopus 로고    scopus 로고
    • Strategy for designing accelerated ageing tests to evaluate IGBT power modules lifetime in real operation mode
    • june
    • J.M. Thebaud et al., "Strategy for designing accelerated ageing tests to evaluate IGBT power modules lifetime in real operation mode", IEEE Trans. On components and packaging technologies, vol.26, no2, pp.429-438, june 2003.
    • (2003) IEEE Trans. On components and packaging technologies , vol.26 , Issue.NO2 , pp. 429-438
    • Thebaud, J.M.1
  • 2
    • 0036540853 scopus 로고    scopus 로고
    • Selected failure mechanisms of modern power modules
    • April-May
    • M. Ciappa, "Selected failure mechanisms of modern power modules", Microelectronics Reliability, Vol.42, no4-5, pp.653-667, April-May 2002.
    • (2002) Microelectronics Reliability , vol.42 , Issue.NO4-5 , pp. 653-667
    • Ciappa, M.1
  • 3
    • 84971421791 scopus 로고    scopus 로고
    • Improving the thermal reliability of large area solder joints in IGBT power modules
    • CIPS
    • K. Guth, P. Mahnke, "Improving the thermal reliability of large area solder joints in IGBT power modules", CIPS, 2006.
    • (2006)
    • Guth, K.1    Mahnke, P.2
  • 4
    • 72949123860 scopus 로고    scopus 로고
    • the latest High Performance and High Reliability IGBT Technology in New packages with Conventional Pin Layout
    • Nuremberg
    • J. Yamada et al., "the latest High Performance and High Reliability IGBT Technology in New packages with Conventional Pin Layout", PCIM conference, Nuremberg, 2003.
    • (2003) PCIM conference
    • Yamada, J.1
  • 8
    • 4544311154 scopus 로고    scopus 로고
    • Influence of the thermo-mechanical residual state due to the power assembly process on the lifetime modellization
    • A. Guédon-Gracia et al., "Influence of the thermo-mechanical residual state due to the power assembly process on the lifetime modellization", Micro-electronics Reliability, vol.44, pp. 1331-1335, 2004.
    • (2004) Micro-electronics Reliability , vol.44 , pp. 1331-1335
    • Guédon-Gracia, A.1
  • 9
    • 0038823751 scopus 로고    scopus 로고
    • Finite-element analysis of a PBGA assembly under isothermal/mechanical twisting loading
    • Q.J. Yang, X.Q. Shi, Z.P. Wang, Z.F. Shi, "Finite-element analysis of a PBGA assembly under isothermal/mechanical twisting loading". Finite Elements in Analysis and Design, Vol.39 pp.819-833, 2003.
    • (2003) Finite Elements in Analysis and Design , vol.39 , pp. 819-833
    • Yang, Q.J.1    Shi, X.Q.2    Wang, Z.P.3    Shi, Z.F.4
  • 10
    • 0020811447 scopus 로고
    • Fatigue Life of Leadless Chip Carrier solder joints during power cycling, IEEE Trans. on comp. hybrids and manuf
    • sept
    • W. Engelmaier, "Fatigue Life of Leadless Chip Carrier solder joints during power cycling", IEEE Trans. on comp. hybrids and manuf. Technology, vol.6, no3, sept. 1983.
    • (1983) Technology , vol.6 , Issue.NO3
    • Engelmaier, W.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.