Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate

Scientific Reports

Volumn 4, Issue , 2014, Pages

  Huang, M L ^a   Yang, F ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL REACTION KINETICS; DISSOLUTION; EXPERIMENTAL MODEL; GRAIN; KINETICS; MODEL; REACTION TIME; THEORETICAL MODEL;

EID: 84925526139     PISSN: None     EISSN: 20452322     Source Type: Journal    
DOI: 10.1038/srep07117     Document Type: Article

References (20)

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