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Volumn , Issue , 2009, Pages 321-324
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Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability
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Author keywords
[No Author keywords available]
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Indexed keywords
CU CONTENT;
DISSOLUTION RATES;
ELECTRONIC PACKAGE;
INTERFACIAL REACTIONS;
INTERMETALLIC COMPOUNDS;
JOINT RELIABILITY;
LEAD FREE SOLDERS;
MOBILE PRODUCTS;
MOLTEN SOLDERS;
SAC ALLOY;
SOLDER BALLS;
SUBSTRATE DESIGN;
VOLUME RATIO;
CHIP SCALE PACKAGES;
DISSOLUTION;
LEAD;
METAL RECOVERY;
PACKAGING;
SEMICONDUCTING INTERMETALLICS;
SILVER;
SOLDERING ALLOYS;
SPHERES;
TIN;
SOLDERING;
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EID: 77950951114
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/EPTC.2009.5416528 Document Type: Conference Paper |
Times cited : (6)
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References (6)
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