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Volumn , Issue , 2009, Pages 321-324

Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability

Author keywords

[No Author keywords available]

Indexed keywords

CU CONTENT; DISSOLUTION RATES; ELECTRONIC PACKAGE; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; JOINT RELIABILITY; LEAD FREE SOLDERS; MOBILE PRODUCTS; MOLTEN SOLDERS; SAC ALLOY; SOLDER BALLS; SUBSTRATE DESIGN; VOLUME RATIO;

EID: 77950951114     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416528     Document Type: Conference Paper
Times cited : (6)

References (6)
  • 1
    • 0036867572 scopus 로고    scopus 로고
    • A "Study of the Effects of Solder Volume on the InterfacialReactions in Solder Joints Using the Differential Scanning Calorimetry Technique,"
    • Choi, W. K., A "Study of the Effects of Solder Volume on the InterfacialReactions in Solder Joints Using the Differential Scanning Calorimetry Technique," Journal of Electronic materials, Vol.31, No.11 (2002), pp. 1283-1291.
    • (2002) Journal of Electronic Materials , vol.31 , Issue.11 , pp. 1283-1291
    • Choi, W.K.1
  • 2
    • 0034829029 scopus 로고    scopus 로고
    • Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation
    • Salam, B, "Study of the Interface Microstructure of Sn-Ag-Cu Lead-Free Solders and the Effect of Solder Volume on Intermetallic Layer Formation," Proc 51th Electronic Components and Technology Conf, Orlando, FL, May. 2001, pp. 471-477. (Pubitemid 32883430)
    • (2001) Proceedings - Electronic Components and Technology Conference , pp. 471-477
    • Salam, B.1    Ekere, N.N.2    Rajkumar, D.3
  • 3
    • 48649107274 scopus 로고    scopus 로고
    • Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders
    • Chang, C. C., "Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders," Proc IMPACT 2007, Taiwan, Oct. 2007, pp. 54-57.
    • Proc IMPACT 2007, Taiwan, Oct. 2007 , pp. 54-57
    • Chang, C.C.1
  • 5
    • 13244270209 scopus 로고    scopus 로고
    • Effects of Cu Contents in Pb-Free Solder Alloys on Interfacial Reactions and Bump Reliability of Pb-Free Solder Bumps on Electroless Ni-P Under-Bump Metallurgy
    • Jeon Y. D., "Effects of Cu Contents in Pb-Free Solder Alloys on Interfacial Reactions and Bump Reliability of Pb-Free Solder Bumps on Electroless Ni-P Under-Bump Metallurgy," Journal of Electronic materials, Vol.34, No.1 (2005), pp. 80-90.
    • (2005) Journal of Electronic Materials , vol.34 , Issue.1 , pp. 80-90
    • Jeon, Y.D.1
  • 6
    • 2342640135 scopus 로고    scopus 로고
    • Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects
    • Kariya Y., "Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects," Journal of Electronic materials, Vol.33, No.4 (2004), pp. 321-328.
    • (2004) Journal of Electronic Materials , vol.33 , Issue.4 , pp. 321-328
    • Kariya, Y.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.