Grain size distribution and heat conductivity of copper processed by equal channel angular pressing

Materials Science and Engineering: A

Volumn 434, Issue 1-2, 2006, Pages 88-94

  Gendelman, O V ^a   Shapiro, M ^a   Estrin, Y ^b   Hellmig, R J ^b   Lekhtmakher, S ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^b CLAUSTHAL UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Copper; Equal channel angular pressing (ECAP); Grain size distribution; Modelling; Thermal conductivity

Indexed keywords

CURVE FITTING; ELECTRON REFLECTION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; METAL PRESSING; THERMAL CONDUCTIVITY;

EQUAL CHANNEL ANGULAR PRESSING; GRAIN SIZE DISTRIBUTION FUNCTION;

COPPER METALLOGRAPHY;

COPPER METALLOGRAPHY; CURVE FITTING; ELECTRON REFLECTION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; METAL PRESSING; THERMAL CONDUCTIVITY;

EID: 33748041669     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.06.091     Document Type: Article

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