A more comprehensive solution for tri-material layers subjected to thermal stress

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 1, 2008, Pages 54-64

  Wong, E H ^a   Lim, Thiam Beng ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Analytical solutions; Electronics packaging; Solder joints; Thermal stress

Indexed keywords

FINITE ELEMENT METHOD; FRACTURE; MICROPROCESSOR CHIPS; SHEAR STRESS; SOLDERED JOINTS; TENSILE PROPERTIES; THERMAL EXPANSION; THERMAL STRESS;

ANALYTICAL SOLUTIONS; PEELING STRESSES; TENSILE FRACTURE; WARPAGE;

ELECTRONICS PACKAGING;

EID: 41349104489     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.906730     Document Type: Article

References (7)

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