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Volumn 79, Issue 1, 2012, Pages

Predicted response of the die-carrier assembly in flexible electronics to the combined action of tension and bending applied to the carrier

Author keywords

[No Author keywords available]

Indexed keywords

ANALYSIS AND DESIGN; COMBINED ACTIONS; CROSS SECTION; NORMAL STRESS; PEELING STRESS; TENSILE FORCES;

EID: 83655202864     PISSN: 00218936     EISSN: 15289036     Source Type: Journal    
DOI: 10.1115/1.4005191     Document Type: Article
Times cited : (5)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.