Mechanical properties of electrodeposited permalloy thin film measured by using a tensile test

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 555-558

  Li, Xueping ^a   Ding, Guifu ^a   Wang, Hong ^a   Ando, Taeko ^b   Shikida, Mitsuhiro ^b   Sato, Kazuo ^b  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b NAGOYA UNIVERSITY   (Japan)

Author keywords

Mechanical properties; Permalloy; Tensile test; Thin Film

Indexed keywords

ACTUATORS; COMPOSITE MICROMECHANICS; COPPER PLATING; ELECTROPLATING; FRACTURE FIXATION; MACHINE DESIGN; MAGNETIC MATERIALS; MATERIALS PROPERTIES; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; NICKEL; SENSORS; SOFT MAGNETIC MATERIALS; TENSILE TESTING; THICK FILMS; TRANSDUCERS;

FRACTURE STRAIN; GAUGE SECTION; INTERNATIONAL CONFERENCES; MICRO SCALES; MICRO-ELECTRO MECHANICAL SYSTEMS; PERMALLOY; PERMALLOY FILMS; SOLID-STATE SENSORS; TENSILE TEST; TESTING METHODS; THIN FILM; YOUNG'S MODULUS;

MECHANICAL PROPERTIES;

EID: 50049102427     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300190     Document Type: Conference Paper

References (7)

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