Experimental investigation of process parameters for roll-type linear chemical mechanical polishing (Roll-CMP) system

Precision Engineering

Volumn 38, Issue 4, 2014, Pages 928-934

  Lee, Hyunseop ^a   Wang, Han ^b   Park, Jaehong ^c   Jeong, Haedo ^b  

^a Tongmyong University   (South Korea)

^b Pusan National University   (South Korea)

^c Nitta Haas Inc   (Japan)

Author keywords

Chemical mechanical polishing (CMP); Copper clad laminate (CCL); Linear Roll CMP; Material removal rate (MRR); Nonuniformity (NU)

Indexed keywords

FLOW RATE; POLISHING; ROLLS (MACHINE COMPONENTS);

CHEMICAL MECHANICAL POLISHING(CMP); COPPER CLAD LAMINATE; LINEAR ROLL-CMP; MATERIAL REMOVAL RATE; NONUNIFORMITY;

CHEMICAL MECHANICAL POLISHING;

EID: 84905120888     PISSN: 01416359     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.precisioneng.2014.06.003     Document Type: Article

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