Chemical and mechanical balance in polishing of electronic materials for defect-free surfaces

CIRP Annals - Manufacturing Technology

Volumn 58, Issue 1, 2009, Pages 485-490

  Lee, H S ^a   Jeong, H D ^a  

^a Pusan National University   (South Korea)

Author keywords

Chemical mechanical polishing (CMP); Electronic material; Mechanism; Polishing

Indexed keywords

CHEMICAL MECHANICAL POLISHING (CMP); CMP PROCESS; DEFECT-FREE SURFACES; ELECTRONIC MATERIAL; MATERIAL PROPERTIES; MECHANICAL BALANCES;

CHEMICAL MECHANICAL POLISHING; CRYSTALLOGRAPHY; DIFFERENTIAL THERMAL ANALYSIS; KNOWLEDGE BASED SYSTEMS; MATERIALS; MECHANISMS; NANOTECHNOLOGY; POLISHING; SURFACES;

CHEMICAL POLISHING;

EID: 67349241206     PISSN: 00078506     EISSN: 17260604     Source Type: Journal    
DOI: 10.1016/j.cirp.2009.03.115     Document Type: Article

References (10)

1. Jeong H., Ohmori H., Doy T., and Nakagawa T. Integrated Planarization Technique with Consistency in Abrasive Machining for Advanced Semiconductor Chip Fabrication. Annals of the CIRP 45 1 (1996) 311-314
2. Venkatesh V.C., Inasaki I., Toenshof H.K., Nakagawa T., and Marinescu I.D. Observations on Polishing and Ultraprecision Machining of Semiconductor Substrate Materials. Annals of the CIRP 44 2 (1995) 611-618
3. Jeong H.D., Park K.H., and Cho K.K. CMP Pad Break-in Time Reduction in Silicon Wafer Polishing. Annals of the CIRP 56 1 (2007) 357-360
4. Che W., Bastawros A., and Chandra A. Surface Evolution during the Chemical Mechanical Planarization. Annals of the CIRP 55 1 (2006) 605-608
5. Komanduri R., Lucca D.A., and Tani Y. Technological Advances in Fine Abrasive Processes. Annals of the CIRP 46 2 (1997) 545-596
6. Tomozawa M. Oxide CMP Mechanisms. Solid State Technology 40 7 (1997) 169-175
7. Cook L. Chemical Processing in Glass Polishing. Journal of Non-Crystalline Solids 120 (1990) 152-171
8. Chung G.S., Chyng S.Y., and Nishino C. Reactive Ion Etching Characteristics of 3C-SiC Grown on Si Wafers. The Journal of the Korean Institute of Metals and Materials 17 7 (2004) 724-728
9. Syvajarvi M., Yakimova R., and Janzen E. Anistropic Etching of SiC. Journal of The Electrochemical Society 147 9 (2000) 3519-3522
10. Ho C.-H., Chin K.-P., Yang C.-R., Wu H.-M., and Chen S.-L. Ultrathick SU-8 mol Formation and Removal, and its Application to the Fabrication of LIGA-like Micromotors with Embedded Roots. Sensor and Actuators A 102 (2002) 130-138