Characterization of copper-hydrogen peroxide film growth kinetics

Thin Solid Films

Volumn 513, Issue 1-2, 2006, Pages 311-318

  DeNardis, D ^a   Rosales Yeomans, D ^a   Borucki, L ^b   Philipossian, A ^a,b  

^a University of Arizona   (United States)

^b Araca Inc   (United States)

Author keywords

Chemical mechanical polishing; Copper oxide; Hydrogen peroxide; X ray diffraction

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER COMPOUNDS; DISSOLUTION; ELLIPSOMETRY; HYDROGEN PEROXIDE; SCANNING ELECTRON MICROSCOPY; THIN FILMS; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

CHEMICAL MECHANICAL PLANARIZATION; COPPER OXIDE; SATURATION POINT;

GROWTH KINETICS;

EID: 33745265637     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.02.010     Document Type: Article

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