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Volumn 47, Issue 7 PART 1, 2008, Pages 5708-5711

Chemical mechanical planarization method for thick copper films of micro-electro-mechanical systems and integrated circuits

(4) Lee, Hyunseop a Joo, Sukbae a Kim, Hyoungjae b Jeong, Haedo a

a Pusan National University (South Korea)

b Korea Institute of Industrial Technology (South Korea)

Author keywords

Chemical mechanical planarization (CMP); Copper; Dishing; Erosion; Photoresist (PR)

Indexed keywords

ACIDS; CHEMICAL MECHANICAL POLISHING; COMPOSITE MICROMECHANICS; COPPER PLATING; EROSION; INTEGRATED CIRCUITS; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; NANOTECHNOLOGY; PHOTORESISTORS; SOIL MECHANICS; SURFACE TREATMENT;

CHEMICAL MECHANICAL PLANARIZATION; CHEMICAL MECHANICAL PLANARIZATION (CMP); COPPER CMP; COPPER DISHING; COPPER FILMS; COPPER PATTERNS; DISHING; HIGH POWERS; HIGHLY INTEGRATED; MECHANICAL STRUCTURES; MICRO-ELECTRO-MECHANICAL SYSTEMS; NEGATIVE PHOTORESISTS; NEW CONCEPTS; PROTECTIVE LAYERS;

COPPER;

EID: 55149099402 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.47.5708 Document Type: Article

Times cited : (15)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.