Abrasive-free polishing for copper damascene interconnection

Journal of the Electrochemical Society

Volumn 147, Issue 10, 2000, Pages 3899-3906

  Kondo, Seiichi ^a   Sakuma, Noriyuki ^a   Homma, Yoshio ^a   Goto, Yasushi ^a   Ohashi, Naofumi ^a   Yamaguchi, Hizuru ^a   Owada, Nobuo ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33744776973     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (20)

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