Dielectric properties of highly filled thermoplastics for printed circuit boards

Journal of Applied Polymer Science

Volumn 128, Issue 6, 2013, Pages 3758-3770

  Apeldorn, Thomas ^a   Keilholz, C ^a   Wolff Fabris, F ^a   Altstadt V ^a  

^a UNIVERSITY OF BAYREUTH   (Germany)

Author keywords

Dielectric properties; Properties and characterization; Thermoplastics

Indexed keywords

DIELECTRIC LOSSES; DIELECTRIC PROPERTIES; FILLERS; MOLECULES; PLASTICS; REINFORCED PLASTICS; SUBSTRATES; THERMAL EXPANSION; THERMOPLASTICS; TIMING CIRCUITS; WATER ABSORPTION;

DIELECTRIC LOSS FACTORS; FILLED THERMOPLASTICS; FITTING PARAMETERS; INSULATING SUBSTRATES; MEASURED PROPERTIES; POLYETHERSULFONES; PRINTED CIRCUIT BOARD (PCBS); THEORETICAL APPROACH;

PRINTED CIRCUIT BOARDS;

EID: 84905118740     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.38602     Document Type: Article

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