Preparation and characterization of high permittivity and low loss PTFE/CaTiO3 microwave laminates

Polymer Composites

Volumn 30, Issue 10, 2009, Pages 1480-1485

  Rajesh, S ^a   Murali, K P ^a   Ratheesh, R ^a  

^a CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY C MET   (India)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SUBSTRATE; EFFECTIVE PERMITTIVITY; FILLER COMPOSITION; FILLER DISTRIBUTION; FILLER LOADING; FLEXIBLE LAMINATES; HIGH PERMITTIVITY; LOSS TANGENT; LOW LOSS; MICROWAVE LAMINATES; MICROWAVE SUBSTRATES; PERMITTIVITY AND LOSS; PHASE FORMATIONS; POWDER X RAY DIFFRACTION; SCANNING ELECTRON MICROSCOPIC; SINGLE PHASE; SOLID-STATE CERAMICS; TEMPERATURE COEFFICIENT; TEMPERATURE RANGE; WAVEGUIDE CAVITY; X-BAND FREQUENCIES;

FILLERS; LAMINATES; MICROWAVES; PERMITTIVITY; PERTURBATION TECHNIQUES;

SUBSTRATES;

EID: 70349554647     PISSN: 02728397     EISSN: 15480569     Source Type: Journal    
DOI: 10.1002/pc.20716     Document Type: Article

References (26)

1. D.-H. Kuo, C.-C. Chang, T.-Y. Su, W.-K. Wang, and B.-Y. Lin, Mater. Chem. Phys., 85, 201 (2004).
2. D.N. Light and J.R. Wilcox, IEEE T. Compon. Pack T. A., 18, 118 (1995).
3. T.S. Laverghetta, Microwave Materials and Fabrication Techniques, Artech house, USA (1984).
4. L.M. Walpita, M.R. Ahern, P. Chen, H. Goldberg, S. Hanely, W.M. Pleban, S. Weinberg, C. Zipp, G. Adams, and Y.H. Wang, IEEE T Microwave Theor., 47, 1577 (1990).
5. R.C. Daigle, G.W. Bull, and D.J. Doyle, Microwave J., 4, 87 (1993).
6. V.S. Nisa, S. Rajesh, K.P. Murali, V. Priyadarsini, S.N. Potty, and R. Ratheesh, Compos. Sci. Technol., 68, 106 (2008).
7. C. Brosseau, P. Queffelec, and P.J. Talbot, Appl. Phys., 89, 45324359 (2001).
8. W.E. Hanford and R.M. Joyce. J. Am. Chem. Soc., 68, 2082 (1946).
9. H.F. Allen, R.R. Traskos, and D.A. Allen, U.S. Patent No. 5,922,453 (1999).
10. H.F. Allen, U.S. Patent No. 5,358,775 (1994).
11. Y.-C. Chen, H.-C. Lin, and Y.-D. Lee, J. Polym. Res, 10, 247 (2003).
12. G. Subodh, M. Joseph, P. Mohanan, and M.T. Sebastian, J. Am. Ceram. Soc., 90, 3507 (2007).
13. A.B. Ariawan, S. Ebnesajjad, and S.G. Hatzikiriakos, Polym. Eng. Sci., 42, 1247 (2002).
14. K.P. Murali, S. Rajesh, V. Priyadarsini, S.N. Potty, P. Mohanan, and R. Ratheesh, Proceedings of APSYM,CUSAT, India, 71 (2006).
15. S. Rajesh, K.P. Murali, K.V. Rajani, and R. Ratheesh, J. Appl. Polym. Sci. (in press).
16. D.C. Dube, M.T. Lanagan, J.H. Kim, and S.J. Jang, J. Appl. Phys, 63, 2466 (1988).
17. S. Rajesh, K.P. Murali, V. Priyadersini, S.N. Potty, R. Ratheesh, and P. Mohanan, Polym. Plast. Technol., 47, 242 (2008).
18. L.A. Wall, Fluropolymers, Wiley Interscience, New York (1972).
19. S. Sasaki, C. Prewitt, J. Bass, and W. Schulze, Acta. Crys- tallogr., 43, 1668 (1987).
20. H.T. Vo and F.G. Shi, Microelectron. J., 33, 409 (2002).
21. M.G. Todd and F.G. Shi, Microelectron. J., 33, 627 (2002).
22. T. Imai, F. Sawa, T. Nakano, T. Ozaki, T. Shimizu, M. Kazako, and T. Tanaka, IEEE T Dielect El In., 13, 319 (2006).
23. A.H. Shivola and J.A. Kong, IEEE T. Geosci. Remote, 26, 420 (1988).
24. B. Tareev, Physics of Dielectric Materials, Vol.116, Mir,Moscow (1979).
25. Y. Rao, J. Qu, T. Marinis, and C.P. Wong, IEEE T. Com- pon. Pack T., 23, 680 (2000).
26. P.L. Wise, I.M. Reaney, W.E. Lee, T.J. Price, D.M. Iddles, and D.S. Cannel, J. Eur. Ceram. Soc., 21, 2963 (2001).