Dielectric, thermal, and mechanical properties of CeO2-filled HDPE composites for microwave substrate applications

Journal of Polymer Science, Part B: Polymer Physics

Volumn 48, Issue 9, 2010, Pages 998-1008

  Anjana, P S ^a   Deepu, V ^b   Uma, S ^b   Mohanan, P ^b   Philip, J ^b   Sebastian, M T ^a  

^a REGIONAL RESEARCH LABORATORY CSIR   (India)

^b Department of Physics   (India)

Author keywords

Composites; Dielectric properties; Mechanical properties; Microstructure; Polyethylene (PE); Thermal properties

Indexed keywords

CERIUM OXIDES; COEFFICIENT OF THERMAL EXPANSION; COMPOSITE SYSTEMS; COMPOSITES; EFFECTIVE PERMITTIVITY; EXPERIMENTAL DATA; HDPE COMPOSITE; MATRIX; MICROWAVE SUBSTRATES; RELATIVE PERMITTIVITY; THEORETICAL APPROACH; THERMAL PROPERTIES;

CERIUM; CERIUM COMPOUNDS; DIELECTRIC LOSSES; DIELECTRIC PROPERTIES OF SOLIDS; MECHANICAL PROPERTIES; MICROHARDNESS; MICROSTRUCTURE; MICROWAVES; PERMITTIVITY; TANNING; TENSILE STRENGTH; THERMAL CONDUCTIVITY; THERMAL STRESS; THERMOANALYSIS; THERMOPLASTICS; TITRATION;

THERMAL EXPANSION;

EID: 77951456871     PISSN: 08876266     EISSN: 10990488     Source Type: Journal    
DOI: 10.1002/polb.21988     Document Type: Article

References (59)

1. Chung, D. L. Materials for Electronic Packaging; Butterworth, Heinemann: Washington, 1995.
2. Garrou. P.; Turlik, I. Multichip Module Technology Handbook; Mc Graw-Hill: New York, 1998.
3. Tian, M. B. Substrates for High Density Package Engineering; Tsinghua University Press: Beijing, 2003.
4. Button, D. P.; Yost, B. A.; French, R. H.; Hsu, W. Y.; Belt, J. D.; Subrahmanian, M. A.; Zhang, H.-M.; Geidd, R. E.; Whittacker, A. J.; Onn, D. G. Advances in Ceramics; American Ceramic Society: Westerville, OH, 1989; Vol.26, pp 353-373.
5. Okhlopkova, A. A.; Shits, F. Y. Mech Comput Mater 2004, 40, 145-150.
6. Wang, Y. M.; Jia, D. C.; Zhou, Y. Piezoelectrics Accoustooptics 2002, 24, 225-229.
7. Thomas, S. L. Microwave Materials and Fabrication Techniques; Artech House Inc.: USA, 1984.
8. Allen, F. H.; Traskos, R. R.; Allen, D. A. U.S. Pat. 5,922,453 (1999).
9. Pelesko, J. A.; Kreigsmann, G. A. J Eng Math 1997, 32, 1-18.
10. Arthur, D. J.; Swei, G. S.; Horn, A. F., III; Kilhenny, B. U.S. Pat. 384,181 (1995).
11. Bur, A. J Polymer 1985, 26, 963-977.
12. Zhou, W.; Qi, S.; An, Q.; Zhao, H.; Liu, N. Mater Res Bull 2007, 42, 1863-1867.
13. Jo, C.; Naguib, H. E. Polymer 2007, 48, 3349-3360.
14. Santha, N.; Sebastian, M. T.; Mohanan, P.; Alford, N. M. N.; Sarma, K.; Pullar, R. C.; Kamba, S.; Pashkin, A.; Samukhina, P.; Petzelt, J. J Am Ceram Soc 2004, 87, 1233-1237.
15. Osaka, M.; Miwa, S.; Tachi, Y. Ceram Int 2006, 32, 659-663.
16. Sebastian, M. T. Dielectric Materials for Wireless Communication; Elsevier Science Technology Publications: Oxford, U. K., 2008.
17. Menon, C. P.; Philip, J. Meas Sci Technol 2000, 11, 1744-1749.
18. Sebastian, M. T.; Menon, C. P.; Philip, J.; Schwartz, R. W. J Appl Phys 2003, 94, 3206-3211.
19. Sihvola, A. H. IEEE Trans Geosci Remote Sens 1988, 26, 420-429.
20. Jayasundere, N.; Smith, B. V. J Appl Phys 1993, 73, 2462-2466.
21. Wakino, K. J Am Ceram Soc 1993, 76, 2588-2594.
22. Poon, Y. M.; Shin, F. G. J Mater Sci 2004, 39, 1277-1281.
23. Rao, Y.; Qu, J.; Marinis, T.; Wong, C. P. IEEE Trans Comp Packag Technol 2000, 23, 680-683.
24. Subodh, G.; Joseph, M.; Mohanan, P.; Sebastian, M. T. J Am Ceram Soc 2007, 90, 3507-3511.
25. Progelhof, R. C.; Throne, J. L.; Reutsch, R. R. Polym Eng Sci 1976, 16, 615-625.
26. Hakansson, B.; Ross, R. G. J Appl Phys 1990, 68, 3285-3292.
27. Landauer, R. In Amercian Institute of Physics Conference Proceedings; Garland, J. C.; Tanner, D. B., Eds.; American Institute of Physics: New York, 1978.
28. Tsao, T. N. G. Ind Eng Chem 1961, 53, 395-397.
29. Kerner, E. H. Proc Phys Soc 1956, 69B, 808-813.
30. Ishikawa, T.; Koyama, K.; Kobayashi, S. J. J Comp Mater 1978, 12, 153-168.
31. Orrhede, M.; Tolani, R.; Salama, K. Res Nondestr Eval 1996, 8, 23-35.
32. Schapery, R. A. J Comp Mater 1968, 2, 380-404.
33. Hashin, Z.; Shtrikman, S. J Mech Phys Solids 1963, 11, 127-140.
34. Grewe, M. G.; Gururaja, T. R.; Shrout, T. R.; Newnham, R. E. IEEE Trans Ultrason Ferroelectr Freq Control 1990, 7, 506-509.
35. Anjana, P. S.; Suma, M. N.; Mohanan, P.; Sebastian, M. T. Int J Appl Ceram Technol 2008, 5, 325-333.
36. Wong, J. Y.; Bronzino, J. D. Biomaterials, Biomaterials; CRC Press: London, 2007.
37. Ramajo, L.; Reboredo, M.; Castro, M. Compos Part A Appl Sci Manuf 2005, 36, 1267-1274.
38. Cheng, K.-C.; Lin, C.-M.; Wang, S.-F.; Lin, S.-T.; Yang, C.-F. Mater Lett 2007, 61, 757-760.
39. Kuo, D.-H.; Chang, C.-C.; Su, T.-Y.; Wang, W.-K.; Lin, B.-Y. J Eur Ceram Soc 2001, 21, 1171-1177.
40. Yu, S.; Hing, P.; Hu, X. J Appl Phys 2002, 88, 398-404.
41. Zhang, H.; Fan, S.; Ke, Y.; Shi, X.; Zeng, Bi. M.; Huang, H. Key Eng Mater 2007, 334-335, 1053-1056.
42. Zhang, L. Y.; Yao, X. Dielectric Physics; Xi'an Jiaotong University Press: Xi'an, 1991.
43. Zhao, X. H.; Wu, Y. G.; Fan, Z. G. J Appl Phys 2004, 95, 8110-8117.
44. Ozmusul, M. S.; Picu, R. C. Polym Comp 2002, 23, 110-119.
45. Qu, J.; Wong, C. P. IEEE Trans Comp Packag Tech 2002, 25, 53-55.
46. Vo, H.; Shi, F. G. Microelectron J 2002, 33, 409-415.
47. Todd, M. G.; Shi, F. G. J Appl Phys 2003, 94, 4551-4557.
48. Hench, L. L.; West, J. K. Principles of Electronic Ceramics; Wiley: New York, 1990.
49. Brosseau, C.; Queffelec, P.; Talbot, P. J Appl Phys 2000, 89, 4532-4540.
50. Kim, W.; Bae, J. W.; Choi, D.; Yong, S. K. Polym Eng Sci 1999, 39, 756-766.
51. He, H.; Fu, R.; Han, Y.; Shen, Y.; Song X. J Mater Sci 2007, 42, 6749-6754.
52. Kumlutas, D.; Tavman, I. H.; Coban, M. T. Compos Sci Technol 2003, 63, 113-117.
53. Agari, Y.; Ueda, A.; Tanaka, M.; Nagai, S. J Appl Polym Sci 1990, 40, 929-941.
54. Beneviste, Y.; Miloh, T. Int J Eng Sci 1986, 24, 1537-1552.
55. Hill, R.; Supancic, P. H. J Am Ceram Soc 2004, 87, 1831-1835.
56. Holliday, L.; Robinson, L. J Mater Sci 1973, 8, 301-311.
57. Subodh, G.; Manjusha, M. V.; Philip, J.; Sebastian, M. T. J Appl Polym Sci 2008, 108, 1716-1721.
58. Wong, C. P.; Bollampally, R. S. J Appl Polym Sci 1999, 74, 3396-3403.
59. Rusu, M.; Sofian, N.; Rusu, D. Polymer Testing 2001, 20, 409-417.