Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 1, 2003, Pages 10-16

  Windlass, Hitesh ^a   Raj, P Markondeya ^a   Balaraman, Devarajan ^a   Bhattacharya, Swapan K ^a   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Capacitors; Integral passives; Nanocomposites; SOP

Indexed keywords

CAPACITANCE; CERAMIC MATERIALS; COATINGS; ELECTRONICS PACKAGING; NANOSTRUCTURED MATERIALS; ORGANIC POLYMERS; PARTICLE SIZE ANALYSIS; PERMITTIVITY; PRINTED CIRCUIT BOARDS; SOLVENTS; SUBSTRATES; THIN FILMS;

INTEGRAL PASSIVES; POLYMER-CERAMIC NANOCOMPOSITE CAPACITORS; SYSTEM-ON-PACKAGE APPLICATIONS;

CAPACITORS;

EID: 0037942568     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.811369     Document Type: Article

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