SCOPUS 정보 검색 플랫폼

Journal of Applied Polymer Science

Volumn 83, Issue 5, 2002, Pages 1084-1090

Novel polymer-ceramic nanocomposite based on high dielectric constant epoxy formula for embedded capacitor application

(4) Rao, Yang a Ogitani, S b Kohl, Paul a Wong, C P a

a Georgia Institute of Technology (United States)

b ASAHI CHEMICAL INDUSTRY CO (Japan)

Author keywords

Embedded capacitor; Metal acacs; Polymer ceramic nanocomposite; SOP

Indexed keywords

CAPACITORS; CERAMIC MATRIX COMPOSITES; CURRENT DENSITY; ELECTRONICS PACKAGING; EPOXY RESINS; MICROSTRUCTURE; MULTICHIP MODULES; NANOSTRUCTURED MATERIALS; PERMITTIVITY; PRINTED CIRCUIT BOARDS; RELIABILITY; SEMICONDUCTING SILICON;

CAPACITANCE DENSITY; EPOXY FORMULA; MULTICHIP MODULE LAMINATE; POLYMER CERAMIC NANOCOMPOSITE;

REINFORCED PLASTICS;

CERAMICS; DIELECTRIC PROPERTY; POLYMER;

EID: 0037203632 PISSN: 00218995 EISSN: None Source Type: Journal
DOI: 10.1002/app.10082 Document Type: Article

Times cited : (332)

References (18)

1
- 0003860827
- Tummala, R., Ed.; International Thompson: New York
- (1997) Microelectronics Packaging Handbook, 2nd Ed.
- Tummala, R.¹ Rymaszewski, E.J.² Klopfenstein, A.G.³

2
- 0007389348
- National Electronic Manufacture Index Roadmap; version
- (1996) Passive Components

3
- 0007374335
- Proceedings of the International Symposium on Microelectronics, Orlando, FL, May 28-31, 1996 , pp. 126-131
- Chahal, P.¹ Tummala, R.² Allen, M.G.³

4
- 85018041092
- IMAPS 35th Nordic Conference, Sweden, Sept. 1998
- Tummala, R.R.¹ Chahal, P.² Bhattacharya, S.³

5
- 0004323875
- McGraw-Hill: New York
- (1995) Basic Electronics, 6th Ed.
- Grob, B.¹

6
- 85018077187
- IPC Conference, San Diego, CA, April 2-6, 2000
- Ogitani, S.¹ Bidstrup-Allen, S.A.² Kohl, P.³

7
- 33644809002
- Proceedings of IMAPS, Braselton, GA, 1999 , pp. 169
- Troutman, T.¹ Bhattacharya, S.² Tummala, R.³ Wong, C.P.⁴

8
- 85008065316
- Proceedings of the 23rd International Electronics Manufacturing Technology Symposium, 1998 , pp. 199-205
- Ogitani, S.¹ Bidstrup-Allen, S.A.² Kohl, P.³

9
- 0031638625
- Proceedings of the 48th Electronic Components and Technology Conference, 1998 , pp. 171-175
- Liang, S.¹ Chong, S.² Giannelis, E.³

10
- 0032156984
- (1998) IEEE Trans Compon Pack Manuf Technol A , vol.21 , pp. 450-458
- Wong, C.P.¹ Shi, S.H.² Jefferson, G.³

11
- 0007392569
- IEEE 48th Electronic Components and Technology Conference, 1998 , pp. 218
- Rector, J.¹

12
- 0007424047
- (1998) Adv Pack , pp. 22-26
- Schaper, L.¹ Lenihan, T.²

13
- 33646902331
- ISHM: Philadelphia, PA
- (1997) Fully Integrated Passives Module for Filter Applications Using Low Temperature Process , pp. 592-597
- Park, J.Y.¹ Bhattacharya, S.K.² Allen, M.G.³

14
- 0023978717
- (1988) Thin Solid Films , vol.158 , pp. 93-105
- Das-Gupta, D.K.¹ Doughty, K.²

15
- 0003811536
- Nalwa, H. S., Ed.; Marcel Dekker: New York
- (1995) Ferroelectric Polymers: Chemistry, Physics, and Applications
- Mazur, K.¹

17
- 0007387337
- (1986) IEEE Trans Elect Insul , pp. 683-692
- Pohl, H.¹

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