Dielectric, mechanical, and thermal properties of low-permittivity polymer-ceramic composites for microelectronic applications

International Journal of Applied Ceramic Technology

Volumn 7, Issue 4, 2010, Pages 461-474

  George, Sumesh ^a   Anjana, Prabhakaran S ^a   Sebastian, Mailadil T ^a   Krupka, Jerzy ^b   Uma, Sreekumar ^c   Philip, Jacob ^c  

^a REGIONAL RESEARCH LABORATORY CSIR   (India)

^b WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^c Department of Physics   (India)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC LOADINGS; HOT MOLDING; LOW LOSS; MELT MIXING; MICROELECTRONIC APPLICATIONS; PACKAGING APPLICATIONS; POLYMER CERAMIC COMPOSITE; POLYSTYRENE COMPOSITES; REINFORCED POLYETHYLENE; REINFORCED POLYMERS; RELATIVE PERMITTIVITY; SOLID-STATE CERAMICS; THEORETICAL MODELS; THERMAL PROPERTIES;

DIELECTRIC LOSSES; DIELECTRIC PROPERTIES OF SOLIDS; MECHANICAL PROPERTIES; MICROELECTRONICS; PERMITTIVITY; POLYMERS; POLYSTYRENES; POWDER METALLURGY; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMOANALYSIS;

CERAMIC MATERIALS;

EID: 77954340944     PISSN: 1546542X     EISSN: 17447402     Source Type: Journal    
DOI: 10.1111/j.1744-7402.2010.02510.x     Document Type: Article

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