Preparation, characterization and properties of Sm2Si2O7 loaded polymer composites for microelectronic applications

Materials Science and Engineering: B

Volumn 163, Issue 2, 2009, Pages 67-75

  Thomas, Sherin ^a   Deepu, V ^b   Uma, S ^b   Mohanan, P ^b   Philip, J ^b   Sebastian, M T ^a  

^a REGIONAL RESEARCH LABORATORY CSIR   (India)

^b Department of Physics   (India)

Author keywords

Composites; Dielectric and thermal properties; Polyethylene; Polystyrene; Sm2Si2O7; Substrates

Indexed keywords

CERAMIC MATERIALS; DIELECTRIC DEVICES; DIELECTRIC LOSSES; DIELECTRIC MATERIALS; FILLED POLYMERS; FILLERS; MICROELECTRONICS; PERMITTIVITY; POLYETHYLENES; SILICON COMPOUNDS; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

DIELECTRICS PROPERTY; MICROELECTRONIC APPLICATIONS; MICROWAVE PACKAGING; PACKAGING APPLICATIONS; POLYETHYLENE COMPOSITES; POLYMER COMPOSITE; POLYSTYRENE COMPOSITES; PROPERTY; RELATIVE PERMITTIVITY; THERMOMECHANICAL PROPERTIES;

POLYSTYRENES;

EID: 67649306194     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2009.05.007     Document Type: Article

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