A numerical method to determine interdiffusion coefficients of Cu 6Sn5 and Cu3Sn intermetallic compounds

Intermetallics

Volumn 40, Issue , 2013, Pages 50-59

  Li, J F ^a   Agyakwa, P A ^a   Johnson, C M ^a  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

Author keywords

A. Intermetallics, miscellaneous; B. Diffusion; C. Joining; D. Phase interfaces; E. Simulations, atomistic

Indexed keywords

ANALYTICAL METHOD; DATA FITTINGS; DIFFUSION CONTROLLED GROWTH; E. SIMULATIONS , ATOMISTIC; INTER-DIFFUSION COEFFICIENTS; INTERMETALLICS , MISCELLANEOUS; SIMULATED RESULTS; SN-BASED SOLDERS;

INTERMETALLICS; NUMERICAL METHODS; PHASE INTERFACES; SOLDERING ALLOYS; TIN;

COPPER COMPOUNDS;

EID: 84877319840     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2013.04.005     Document Type: Article

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