Preparation of ultra fine copper-nickel bimetallic powders for conductive thick film

Intermetallics

Volumn 15, Issue 10, 2007, Pages 1316-1321

  Songping, Wu ^a   Li, Jiao ^a   Jing, Ni ^a   Zhenou, Zeng ^a   Song, Liu ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

A. Composites; B. Alloy design; C. Reaction synthesis; C. Sintering; D. Microstructure

Indexed keywords

ALLOY DESIGN; BIMETALLIC POWDERS; PROTECTIVE AGENTS; REACTION SYNTHESIS;

COMPOSITE MATERIALS; CONDUCTIVE FILMS; COPPER ALLOYS; HYDROTHERMAL SYNTHESIS; MICROSTRUCTURE; POLYETHYLENE GLYCOLS; SINTERING; THERMOANALYSIS; THICK FILMS;

BIMETALS;

EID: 34447257431     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2007.04.001     Document Type: Article

References (20)

1. Wu S.P., and Meng S.Y. Preparation of ultrafine silver powder using ascorbic acid as reducing agent and its application in MLCI. Materials Chemistry and Physics 89 2-3 (2005) 423-427
2. Aiello R., Fiscus J.E., zur Loye H.-C., and Amiridis M.D. Applied Catalysis A: General 192 (2000) 227-234
3. Ould Ely T., Amiens C., Chaudret B., Snoeck E., and Verelst M. Chemistry of Materials 11 (1999) 536-539
4. 3 nano particle on paste and sintering properties of Ni internal electrode films by MLCC. Journal of the Ceramic Society of Japan 111 4 (2003) 282-284
5. Wu S.P., and Meng S.Y. Preparation of micron size copper powder with chemical reduction method. Materials Letters 60 20 (2006) 2438-2442
6. Hibino T., Hashimoto A., Inoue T., Tokuno J.-I., Yoshida S.-I., and Sano M. Science 288 (2000) 2031-2033
7. Wu S.P. Termination of BME-MLCC using copper-nickel bimetallic powder as electrode material. IEEE Transactions on Components and Packaging Technologies 29 4 (2006) 827-832
8. Wu S.P., Qin H.L., and Li P. Preparation of fine copper powders and their application in BME-MLCC. Journal of University of Science and Technology Beijing 13 3 (Jun 2006) 250-255
9. Park S., Vohs J.M., and Gorte R.J. Nature 404 (2000) 265
10. Li Y., Chen J., Chang L., and Qin Y. Journal of Catalysis 178 (1998) 76-83
11. Bautista F.M., Campelo J.M., Garca A., Guardeno R., Luna D., and Marinas J.M. Journal of Molecular Catalysis A: Chemical 104 (1996) 229-235
12. Samel'yan R.G., Abovyan E.S., Agbalyan S.G., Manukyan N.N., and Sakanyan M.S. Soviet Powder Metallurgy Metal Ceramics 30 (1991) 606
13. Viau G., Fie′ vet-Vincent F., and Fie′ vet F. Solid States Ionics 84 (1996) 259-270
14. Chow G.M., Kurihara L.K., Kemmer K.M., Schoen P.E., Elam W.T., Ervin A., et al. Journal of Materials Research 10 (1995) 6
15. Bonet F., Grugeon S., Dupont L., Urbina R.H., Guery C., and Tarascon J.M. Synthesis and characterization of bimetallic Ni-Cu particles. Journal of Solid State Chemistry 172 1 (2003) 111-115
16. Wang C., Zhang X.M., Qian X.F., Xie Y., Wang W.Z., and Qian Y.T. Preparation of nanocrystalline nickel powders through hydrothermal-reduction method. Materials Research Bulletin 33 12 (1998) 1747-1751
17. Kutty T.R.N., Tareen J.A.K., Basavalingu B., and Puttaraju B. Low-temperature hydrothermal reduction of metalhydroxides to metal powders. Materials Letters 1 2 (1982) 67-70
18. Wu S.P. Preparation of fine copper powder using ascorbic acid as reducing agent and its application in MLCC. Materials Letters 61 4-5 (2007) 1125-1129
19. Wu S.P. Preparation of ultra fine nickel-copper bimetallic powder for BME-MLCC. Microelectronics Journal 38 1 (2007) 41-46
20. Nagesh V.K., Tomsia A.P., and Pask J.A. Wetting and reactions in the lead borosilicate glass-precious metal systems. Journal of Materials Science 18 (1983) 2173-2180