Characterization of Au-Sn eutectic die attach process for optoelectronics device

Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging

Volumn 2005, Issue , 2005, Pages 118-124

  Thang, Tak Seng ^a   Sun, Decai ^a   Koay, Huck Khim ^a   Sabudin, Mohd Fezley ^a   Thompson, Jim ^a   Martin, Paul ^a   Rajkomar, Pradeep ^a   Haque, Shatil ^a  

^a Lebuh Kampung Jawa   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

LIGHT EMITTING DIODES; OPTOELECTRONIC DEVICES; PHASE COMPOSITION; SEMICONDUCTOR LASERS; SOLDERED JOINTS; STRENGTH OF MATERIALS; THERMODYNAMIC PROPERTIES;

BONDING INTERFACES; EUTECTIC BONDER; EUTECTIC DIE ATTACH PROCESS; LIQUIDUS TEMPERATURE;

EUTECTICS;

EID: 33847299403     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2005.1598246     Document Type: Conference Paper

References (8)

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3. Shi, X.Q., "Au/Sn Solder for Face-Down Bonding of AlGaAs/GaAs Ridge Waveguide Laser Diodes," Singapore Institute of Manufacturing Technology, Technical Reports (2004), pp. 57.
4. Chang, Kuo-Chin & Kuo-Ning Chiang, "Aging Study on Interfacial Microstructure and Solder-Ball Shear Strength of a Wafer-Level Chip-Size Package with Au/Ni Metallization on a Cu Pad," Journal of Electronic Materials, Vol. 33, No. 11 (2004), pp. 1373.
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8. Song, H.G. et al, "The Microstructure of Eutectic Au-Sn Solder Bumps on Cu/Electroles Ni/Au," Department of Materials and Engineering, University of California at Berkeley (2001), pp. 3-7.