Thermal fatigue characteristics of die attach materials for packaged high-brightness LEDs

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 8, 2012, Pages 1346-1350

  Zhang, Guangchen ^a   Feng, Shiwei ^a   Zhou, Zhou ^a   Liu, Jing ^a   Li, Jingwan ^a   Zhu, Hui ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Die attach; light emitting diodes (LEDs); structure function

Indexed keywords

C-MODE SCANNING ACOUSTIC MICROSCOPIES; COFFIN-MANSON; CROSS-SECTIONAL SCANNING ELECTRON MICROSCOPIES; DIE-ATTACH MATERIALS; DRIVING CURRENT; FAILURE MECHANISM; FATIGUE CHARACTERISTICS; HIGH BRIGHTNESS; POWER CYCLING; POWER DENSITIES; SILVER PASTES; STRUCTURE FUNCTION METHOD; STRUCTURE FUNCTIONS; TEMPERATURE DIFFERENCES; TRANSIENT TEMPERATURE RESPONSE;

EUTECTICS; LUMINANCE; MATERIALS; SCANNING ELECTRON MICROSCOPY; THERMAL FATIGUE;

LIGHT EMITTING DIODES;

EID: 84864660886     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2200295     Document Type: Article

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