Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves

Ultrasonics Sonochemistry

Volumn 21, Issue 3, 2014, Pages 924-929

  Li, Zhuolin ^a   Li, Mingyu ^a   Xiao, Yong ^a   Wang, Chunqing ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Cavitation; Erosion; Intermetallic compounds; Ultrasonic waves

Indexed keywords

BINARY ALLOYS; CAVITATION; EROSION; INTERMETALLICS; PHASE INTERFACES; SEMICONDUCTOR DEVICE MANUFACTURE; SOLDERING ALLOYS; SONOCHEMISTRY; TIN ALLOYS; ULTRASONIC EFFECTS; ULTRASONIC WAVES;

ACOUSTIC CAVITATIONS; HIGH MELTING POINT; INTERCONNECTION SYSTEMS; INTERMETALLIC PHASE; SEMICONDUCTOR INDUSTRY; TRANSIENT LIQUID PHASE; ULTRASONIC BONDING; ULTRASONIC VIBRATION;

COPPER ALLOYS;

CUPROUS ION; TIN;

ARTICLE; CRYSTALLIZATION; ENVIRONMENTAL TEMPERATURE; KINETICS; MELTING POINT; PRIORITY JOURNAL; ROOM TEMPERATURE; SHOCK WAVE; THICKNESS; ULTRASOUND;

EID: 84895069541     PISSN: 13504177     EISSN: 18732828     Source Type: Journal    
DOI: 10.1016/j.ultsonch.2013.09.020     Document Type: Article

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