Influence of thermal annealing on structural, morphological, optical and electrical properties of NiO-Cu composite thin films

Materials Express

Volumn 4, Issue 1, 2014, Pages 32-40

  Ashok Kumar Reddy, Y ^a   Ajitha, B ^a   Sreedhara Reddy, P ^a  

^a SRI VENKATESWARA UNIVERSITY   (India)

Author keywords

Annealing temperature; Grain size; NiO Cu composite films; Resistivity; Sputtering

Indexed keywords

EID: 84892767121     PISSN: 21585849     EISSN: 21585857     Source Type: Journal    
DOI: 10.1166/mex.2014.1145     Document Type: Article

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